Abstract
With the continued advancement of electronic devices toward higher performance and greater integration, vibration control of printed circuit boards (PCBs) has become a critical factor in ensuring their operational stability and longevity. However, PCBs often face challenges such as size constraints and limited available space. In this context, piezoelectric shunting damping technology, which is structurally simple and requires fewer components, has emerged as an effective and practical solution. However, traditional piezoelectric shunting damping methods often face difficulties in addressing low-frequency vibrations due to challenges in achieving the required inductance values. To overcome this limitation, the present study analyzes series, parallel, and negative capacitance shunting damping circuits based on piezoelectric shunting damping technology. An approach is proposed wherein simulated inductance replaces real inductance. Simulation results demonstrate the consistency between the impedance characteristics of simulated and real inductance. Furthermore, vibration control experiments were conducted on PCBs using the designed piezoelectric shunting damping system, confirming both the feasibility of suppressing PCB vibrations using this damping technology and the effectiveness of replacing real inductance with simulated inductance. The RL parallel circuit achieves a vibration amplitude attenuation of 12.6391 dB, the RL series circuit provides an attenuation of 12.085 dB, and the resistor and negative capacitance series circuit offers an attenuation of 6.5812 dB. This research provides new insights into vibration control technology for plate-shell structures.
