New techniques for processing transient liquid crystal heat transfer experiment have been developed. The methods are able to measure detailed local heat transfer coefficient and adiabatic wall temperature in a three temperature system from a single transient test using the full intensity history recorded. Transient liquid crystal processing methods invariably assume that lateral conduction is negligible and so the heat conduction process can be considered one-dimensional into the substrate. However, in regions with high temperature variation such as immediately downstream of a film-cooling hole, it is found that lateral conduction can become significant. For this reason, a procedure which allows for conduction in three dimensions was developed by the authors. The paper is the first report of a means of correcting data from the transient heat transfer liquid crystal experiments for the effects of significant lateral conduction. The technique was applied to a film cooling system as an example and a detailed uncertainty analysis performed.
A Technique for Processing Transient Heat Transfer, Liquid Crystal Experiments in the Presence of Lateral Conduction
Contributed by the International Gas Turbine Institute and presented at the International Gas Turbine and Aeroengine Congress and Exhibition, Atlanta, GA, June 16–19, 2003. Manuscript received by the IGTI Dec. 2002; final revision Mar. 2003. Paper No. 2003-GT-38446. Review Chair: H. R. Simmons.
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Ling, J. P. C. W., Ireland, P. T., and Turner, L. (June 15, 2004). "A Technique for Processing Transient Heat Transfer, Liquid Crystal Experiments in the Presence of Lateral Conduction ." ASME. J. Turbomach. April 2004; 126(2): 247–258. https://doi.org/10.1115/1.1740777
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