The local viscoelastic properties of soft polishing pads with different usage durations are measured by a micro-scale mechanical analysis testing platform. The testing reveals stimulus-adaptive local viscoelasticity of soft pads under the activation of asperity contact. This phenomenon suggests asperity-dependent local modulus. Such an increase of local modulus induced by higher asperity provides a further enhancement effect to the planarization of surface asperity. Furthermore, the measurement outcomes suggest that the reaction of local micro-scale viscoelastic properties of the soft pad surface to the workpiece asperity will decay with usage time. The current study provides a detailed understanding of the aging effects for the soft pad and explains the performance decay during soft pad polishing from a local micro-scale interfacial perspective.

References

References
1.
Marinescu
,
D.
,
Uhlmann
,
E.
, and
Doi
,
T.
,
2006
,
Handbook of Lapping and Polishing
,
CRC Press
,
Boca Raton, FL
.
2.
Komanduri
,
R.
,
Lucca
,
D. A.
, and
Tani
,
Y.
,
1997
, “
Technological Advances in Fine Abrasive Process
,”
CIRP Ann.-Manuf. Technol.
,
46
(
2
), pp.
545
596
.
3.
McGrath
,
J.
, and
Davis
,
C.
,
2004
, “
Polishing Pad Surface Characterization in Chemical Mechanical Planarisation
,”
J. Mater. Process. Tech.
,
153
(
1
), pp.
666
673
.
4.
Fu
,
G.
, and
Chandra
,
A.
,
2002
, “
A Model for Wafer Scale Variation of Material Removal Rate in Chemical Mechanical Polishing Based on Viscoelastic Pad Deformation
,”
J. Electron. Mater.
,
31
(
10
), pp.
1066
1073
.
5.
Kim
,
B. S.
,
Tucker
,
M. H.
,
Kelchner
,
J. D.
, and
Beaudoin
,
S. P.
,
2008
, “
Study on the Mechanical Properties of CMP Pads
,”
IEEE Trans. Semicond. Manuf.
,
21
(
3
), pp.
454
463
.
6.
Huey
,
S.
,
Mear
,
S. T.
,
Wang
,
Y.
,
Jin
,
R.
,
Ceresi
,
J.
,
Freeman
,
P.
,
Johnson
,
D.
,
Vo
,
T.
, and
Eppert
,
S.
, “
Technological Breakthrough in Pad Life Improvement and Its Impact on CMP CoC
,”
IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop
,
Boston, MA
,
Sept. 8–10, 1999
, ASMC 99 Proceedings No. 99CH36295, pp.
54
58
7.
Lee
,
W. J.
,
Park
,
H. S.
, and
Shin
,
H. S.
,
2009
, “
Enhancement of CMP pad Lifetime for Shallow Trench Isolation Process Using Profile Simulation
,”
Curr. Appl. Phys.
,
9
(
1
), pp.
S134
S137
.
8.
Fischer-Cripps
,
A. C.
,
2004
,
Nanoindentation
,
2nd ed.
,
Springer-Verlag
,
New York
.
9.
Menard
,
K. P.
,
2008
,
Dynamic Mechanical Analysis: A Practical Introduction
,
2nd ed.
,
CRC Press
,
Boca Raton, FL
.
10.
Herbert
,
E. G.
,
Oliver
,
W. C.
, and
Pharr
,
G. M.
,
2008
, “
Nanoindentation and the Dynamic Characterization of Viscoelastic Solids
,”
J. Phys. D: Appl. Phys.
,
41
(
7
), p.
074021
.
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