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Keywords: microprocessor chips
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2011, 3(4): 041003.
Published Online: October 24, 2011
... that the piping connecting the main components is considered to be adiabatic having no pressure losses, while the potential and kinetic energy effects in the cooling cycle are also neglected. 21 09 2010 16 05 2011 24 10 2011 24 10 2011 cooling microprocessor chips refrigerants...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2010, 2(4): 041001.
Published Online: January 6, 2011
... temperatures and temperature gradients), implementation of newer, more effective methods of cooling are being considered, of which heat transfer is not necessarily uniform. component placement hot spot numerical temperature gradient power map 3D stack stacked dies microprocessor chip...