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Journal Articles

Active Cooling System for Downhole Electronics in High-Temperature Environments

Minghui Wei, Wei Cai, Mingze Xu, Shuang Deng
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. August 2022, 14(8): 081009.
Paper No: TSEA-21-1464
https://doi.org/10.1115/1.4053120
Published Online: January 12, 2022
View Article titled, Active Cooling System for Downhole Electronics in High-Temperature Environments
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Topics: Cooling, Cooling systems, Electronic components, Electronics, Heat, Heat transfer, High temperature, Refrigerants, Temperature, Pressure
Journal Articles

Thermal Protection by Integration of Vacuum Insulation Panel in Liquid-Cooled Active Thermal Management for Electronics Package Exposed to Thermal Radiation

Midhun V. C., S. Suresh
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2022, 14(1): 011014.
Paper No: TSEA-21-1366
https://doi.org/10.1115/1.4052740
Published Online: November 18, 2021
View Article titled, Thermal Protection by Integration of Vacuum Insulation Panel in Liquid-Cooled Active Thermal Management for Electronics Package Exposed to Thermal Radiation
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Topics: Flow (Dynamics), Heat, Insulation, Thermal management, Thermal radiation, Temperature, Stress, Cooling, Coolants, Vacuum
Journal Articles

Optimal Design of Three-Dimensional Heat Flow Structures for Power Electronics Applications

Ercan M. Dede, Yanghe Liu, Shailesh N. Joshi, Feng Zhou, Danny J. Lohan, Jong-Won Shin
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021011.
Paper No: TSEA-18-1001
https://doi.org/10.1115/1.4041440
Published Online: December 5, 2018
View Article titled, Optimal Design of Three-Dimensional Heat Flow Structures for Power Electronics Applications
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Topics: Design, Flow (Dynamics), Gates (Closures), Heat, Optimization, Temperature, Electronics, Manufacturing
Journal Articles

Microstructured Surfaces for Single-Phase Jet Impingement Heat Transfer Enhancement

Gilberto Moreno, Sreekant Narumanchi, Travis Venson, Kevin Bennion
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2013, 5(3): 031004.
Paper No: TSEA-12-1033
https://doi.org/10.1115/1.4023308
Published Online: June 24, 2013
View Article titled, Microstructured Surfaces for Single-Phase Jet Impingement Heat Transfer Enhancement
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Topics: Cooling, Heat transfer, Water, Impingement cooling, Electronics, Coatings, Nozzles, Fluids
Journal Articles

Development of Compact Thermal–Fluid Models at the Electronic Equipment Level

Jason Stafford, Ronan Grimes, David Newport
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2012, 4(3): 031007.
https://doi.org/10.1115/1.4006715
Published Online: July 16, 2012
View Article titled, Development of Compact Thermal–Fluid Models at the Electronic Equipment Level
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Topics: Boundary-value problems, Computational fluid dynamics, Design, Electronic equipment, Electronics, Flow (Dynamics), Heat, Modeling, Optimization, Temperature
Journal Articles

Enhanced Miniature Loop Heat Pipe Cooling System for High Power Density Electronics

J. H. Choi, B. H. Sung, J. H. Yoo, C. J. Kim, D.-A. Borca-Tasciuc
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2012, 4(2): 021008.
https://doi.org/10.1115/1.4005734
Published Online: April 20, 2012
View Article titled, Enhanced Miniature Loop Heat Pipe Cooling System for High Power Density Electronics
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Topics: Cooling systems, Fluids, Heat, Heat pipes, Heat transfer, Power density, Temperature, Thermal resistance, Electronics, Copper
Journal Articles

Thermal Management of High Density Power Electronics Modules Using Dielectric Mineral Oil With Applications in the Electric Utility Field for Smart Grid Protection

Ronald Warzoha, Amy S. Fleischer
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2011, 3(4): 041005.
https://doi.org/10.1115/1.4004746
Published Online: October 28, 2011
View Article titled, Thermal Management of High Density Power Electronics Modules Using Dielectric Mineral Oil With Applications in the Electric Utility Field for Smart Grid Protection
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Topics: Density, Design, Electronics, Flow (Dynamics), Heat sinks, Mineral oil, Natural convection, Operating temperature, Smart grids, Steady state
Journal Articles

Thermal Management of a 15   kV / 100   kVA Intelligent Universal Transformer

Ronald Warzoha, Amy S. Fleischer
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. March 2011, 3(1): 011002.
https://doi.org/10.1115/1.4003608
Published Online: March 10, 2011
View Article titled, Thermal Management of a 15   kV / 100   kVA Intelligent Universal Transformer
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Topics: Design, Electronics, Fins, Heat pipes, Operating temperature, Temperature, Thermal management, Steady state, Copper
Journal Articles

Application of Thermoelectric-Adsorption Cooler for Harsh Environment Electronics Under Varying Heat Load

Ashish Sinha, Yogendra Joshi
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2010, 2(2): 021004.
https://doi.org/10.1115/1.4002590
Published Online: October 21, 2010
View Article titled, Application of Thermoelectric-Adsorption Cooler for Harsh Environment Electronics Under Varying Heat Load
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Topics: Cooling, Cycles, Electronics, Heat, Stress, Temperature, Desorption, Heat pumps, Cooling systems, Vapors