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J. Thermal Sci. Eng. Appl. February 2024, 16(2): 021001. doi: https://doi.org/10.1115/1.4063826
J. Thermal Sci. Eng. Appl. February 2024, 16(2): 021002. doi: https://doi.org/10.1115/1.4063921
J. Thermal Sci. Eng. Appl. February 2024, 16(2): 021003. doi: https://doi.org/10.1115/1.4063912
J. Thermal Sci. Eng. Appl. February 2024, 16(2): 021004. doi: https://doi.org/10.1115/1.4063915
J. Thermal Sci. Eng. Appl. February 2024, 16(2): 021005. doi: https://doi.org/10.1115/1.4063916
J. Thermal Sci. Eng. Appl. February 2024, 16(2): 021006. doi: https://doi.org/10.1115/1.4063913
J. Thermal Sci. Eng. Appl. February 2024, 16(2): 021007. doi: https://doi.org/10.1115/1.4064077
J. Thermal Sci. Eng. Appl. February 2024, 16(2): 021008. doi: https://doi.org/10.1115/1.4063911
J. Thermal Sci. Eng. Appl. February 2024, 16(2): 021009. doi: https://doi.org/10.1115/1.4064076
J. Thermal Sci. Eng. Appl. February 2024, 16(2): 021010. doi: https://doi.org/10.1115/1.4064138
J. Thermal Sci. Eng. Appl. February 2024, 16(2): 021011. doi: https://doi.org/10.1115/1.4064134
J. Thermal Sci. Eng. Appl. February 2024, 16(2): 021012. doi: https://doi.org/10.1115/1.4064139
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