This paper compares the economic viability and performance outcomes of two different thermoelectric device architectures to determine the advantages and appropriate use of each configuration. Hybrid thermoelectric coolers (TECs) employ thin-film thermoelectric materials sandwiched between a plastic substrate and form a corrugated structure. Roll-to-roll (R2R) manufacturing and low-cost polymer materials offer a cost advantage to the hybrid architecture at the sacrifice of performance capabilities while conventional bulk devices offer increased performance at a higher cost. Performance characteristics and cost information are developed for both hybrid and conventional bulk single-stage thermoelectric modules. The design variables include device geometry, electrical current input, and thermoelectric material type. The tradeoffs between cooling performance and cost will be explored, and the thermoelectric system configuration is analyzed for both hybrid and conventional bulk TECs.
Skip Nav Destination
Article navigation
June 2016
Research-Article
Performance and Design Comparison of a Bulk Thermoelectric Cooler With a Hybrid Architecture
Margaret Antonik,
Margaret Antonik
Mechanical and Aerospace Engineering,
North Carolina State University,
911 Oval Drive,
Raleigh, NC 27695
e-mail: mrantoni@ncsu.edu
North Carolina State University,
911 Oval Drive,
Raleigh, NC 27695
e-mail: mrantoni@ncsu.edu
Search for other works by this author on:
Brendan T. O'Connor,
Brendan T. O'Connor
Assistant Professor
Mechanical and Aerospace Engineering,
North Carolina State University,
911 Oval Drive,
Raleigh, NC 27695
e-mail: btoconno@ncsu.edu
Mechanical and Aerospace Engineering,
North Carolina State University,
911 Oval Drive,
Raleigh, NC 27695
e-mail: btoconno@ncsu.edu
Search for other works by this author on:
Scott Ferguson
Scott Ferguson
Associate Professor
Mechanical and Aerospace Engineering,
North Carolina State University,
911 Oval Drive,
Raleigh, NC 27695
e-mail: scott_ferguson@ncsu.edu
Mechanical and Aerospace Engineering,
North Carolina State University,
911 Oval Drive,
Raleigh, NC 27695
e-mail: scott_ferguson@ncsu.edu
Search for other works by this author on:
Margaret Antonik
Mechanical and Aerospace Engineering,
North Carolina State University,
911 Oval Drive,
Raleigh, NC 27695
e-mail: mrantoni@ncsu.edu
North Carolina State University,
911 Oval Drive,
Raleigh, NC 27695
e-mail: mrantoni@ncsu.edu
Brendan T. O'Connor
Assistant Professor
Mechanical and Aerospace Engineering,
North Carolina State University,
911 Oval Drive,
Raleigh, NC 27695
e-mail: btoconno@ncsu.edu
Mechanical and Aerospace Engineering,
North Carolina State University,
911 Oval Drive,
Raleigh, NC 27695
e-mail: btoconno@ncsu.edu
Scott Ferguson
Associate Professor
Mechanical and Aerospace Engineering,
North Carolina State University,
911 Oval Drive,
Raleigh, NC 27695
e-mail: scott_ferguson@ncsu.edu
Mechanical and Aerospace Engineering,
North Carolina State University,
911 Oval Drive,
Raleigh, NC 27695
e-mail: scott_ferguson@ncsu.edu
Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF THERMAL SCIENCE AND ENGINEERING APPLICATIONS. Manuscript received August 11, 2015; final manuscript received December 18, 2015; published online March 1, 2016. Assoc. Editor: Samuel Sami.
J. Thermal Sci. Eng. Appl. Jun 2016, 8(2): 021022 (13 pages)
Published Online: March 1, 2016
Article history
Received:
August 11, 2015
Revised:
December 18, 2015
Citation
Antonik, M., O'Connor, B. T., and Ferguson, S. (March 1, 2016). "Performance and Design Comparison of a Bulk Thermoelectric Cooler With a Hybrid Architecture." ASME. J. Thermal Sci. Eng. Appl. June 2016; 8(2): 021022. https://doi.org/10.1115/1.4032637
Download citation file:
Get Email Alerts
Temporal Convolutional Neural Network-Based Cold Load Prediction for Large Office Buildings
J. Thermal Sci. Eng. Appl
HARNESSING DEEP LEARNING TO SOLVE INVERSE TRANSIENT HEAT TRANSFER WITH PERIODIC BOUNDARY CONDITION
J. Thermal Sci. Eng. Appl
Related Articles
Lyapunov Control Strategy for Thermoelectric Cooler Activating an Ice-Clamping System
J. Thermal Sci. Eng. Appl (August,2018)
Optimization of Thermoelectric Coolers for Hotspot Cooling in Three-Dimensional Stacked Chips
J. Electron. Packag (March,2015)
Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System
J. Electron. Packag (September,2011)
Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger Arrangement
J. Electron. Packag (December,2011)
Related Proceedings Papers
Related Chapters
Thermoelectric Coolers Are Hot
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Thermoelectric Coolers
Thermal Management of Microelectronic Equipment
Design Guidelines for Architectural Uses of Stainless Steel
Stainless Steel for Architectural Use