Two-phase thermosyphons with condensers from roll-bonded panels, short “roll-bond thermosiphons,” are attractive for power-electronics cooling. Using simulations, the performance of roll-bond thermosyphons and classical heat sinks is compared. The roll-bond thermosyphons are advantageous in terms of trade-off between thermal resistance, cooler volume or mass, and sound-power level. Under forced convection, where air-side heat-transfer coefficients are comparatively high, the classical heat sink suffers from low fin efficiency and limited heat spreading. By increasing the number of panels, the roll-bond thermosyphon enables low thermal resistances that cannot be practically reached with classical heat sinks. For free air convection, the roll-bond thermosyphon allows a significant reduction of thermal resistance and cooler mass.
Assessment of Two-Phase Cooling of Power Electronics Using Roll-Bonded Condensers
Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF THERMAL SCIENCE AND ENGINEERING APPLICATIONS. Manuscript received March 25, 2014; final manuscript received July 30, 2014; published online September 16, 2014. Assoc. Editor: Hongbin Ma.
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Gradinger, T. B., and Agostini, F. (September 16, 2014). "Assessment of Two-Phase Cooling of Power Electronics Using Roll-Bonded Condensers." ASME. J. Thermal Sci. Eng. Appl. March 2015; 7(1): 011002. https://doi.org/10.1115/1.4028346
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