With a substantial increase in thermal power density, the operating temperature of high-power light-emitting diodes (LEDs) rises rapidly, exerting a notable effect on chipsets’ performance. A water-cooled microchannel radiator and an air-cooled radiator are proposed to solve this problem. The effects of key factors of both radiators on heat dissipation in a high-power LED chipsets, and general comparisons between each method, are analyzed via Fluent. The simulation results indicate that heat dissipation from the water-cooled microchannel radiator is readily affected by the microchannel’s flow rate and aspect ratio. A larger flow rate and larger aspect ratio favor improved heat dissipation in the water-cooled microchannel radiator. Heat dissipation in the air-cooled radiator is related to volumetric flow rate, rib number, rib height, rib thickness, and substrate thickness. A larger volumetric flow rate, rib number, and rib height favor heat dissipation in the air-cooled radiator. However, there is a critical thickness value: if the thickness is less than the critical value, heat dissipation is greatly affected by rib thickness and substrate thickness, if the thickness is larger than the critical value, the influence is insignificant. The high-power LED chipsets’ temperature is also related to the insulating substrate’ input power and thermal conductivity. A large input power leads to a substantial increase in temperature, and larger thermal conductivity of the insulating substrate minimizes temperature increase in the high-power LED chipsets. When comparing the two radiators, results show an air-cooled radiator should be used in low-power LED chipsets. When an air-cooled radiator cannot satisfy the chipset’s needs, a water-cooled microchannel radiator should be utilized.
Comparative Analysis Between Water-Cooled and Air-Cooled Heat Dissipation in a High-Power Light-Emitting Diode Chipset
Contributed by the Heat Transfer Division of ASME for publication in the Journal of Thermal Science and Engineering Applications. Manuscript received August 1, 2018; final manuscript received February 18, 2019; published online May 3, 2019. Assoc. Editor: Aaron P. Wemhoff.
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Chen, Y., Hou, T., and Pan, M. (May 3, 2019). "Comparative Analysis Between Water-Cooled and Air-Cooled Heat Dissipation in a High-Power Light-Emitting Diode Chipset." ASME. J. Thermal Sci. Eng. Appl. December 2019; 11(6): 061002. https://doi.org/10.1115/1.4043004
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