A simple approach is developed to obtain a multiscale network of heat conducting by filling spherical alumina (S-Al2O3) and graphene nanoplatelets (GnPs) into silicone rubber (SR). This unique structure effectively minimizes the thermal contact resistance between fillers and matrix. The physical properties of the composites are characterized by thermal conductivity, density, and tensile strength. A high thermal conductivity of 3.37 Wm−1 K−1 has been achieved, which is 47.1% higher than the single filler at the same loading. A strong and obvious synergistic effect has been observed as S-Al2O3 and GnPs filled into silicone rubber matrix. It is interesting that the composites with GnPs have the lower density (2.62 g/cm3, reduced by 6%) and the superior tensile performance, compared to silicone rubber composite with neat S-Al2O3. The composites have the potential applications in heat dissipation of light-emitting diode.
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February 2018
Research-Article
Thermal Conductivity and Mechanical Properties of Low-Density Silicone Rubber Filled With Al2O3 and Graphene Nanoplatelets
Yingchun Zhang,
Yingchun Zhang
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Search for other works by this author on:
Wei Yu,
Wei Yu
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
e-mail: yuwei@sspu.edu.cn
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
e-mail: yuwei@sspu.edu.cn
Search for other works by this author on:
Liye Zhang,
Liye Zhang
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Search for other works by this author on:
Junshan Yin,
Junshan Yin
Shanghai Yueda New Material Science
and Technology Co. Ltd.,
Shanghai 201209, China
and Technology Co. Ltd.,
Shanghai 201209, China
Search for other works by this author on:
Jingkang Wang,
Jingkang Wang
Shanghai Yueda New Material Science
and Technology Co. Ltd.,
Shanghai 201209, China
and Technology Co. Ltd.,
Shanghai 201209, China
Search for other works by this author on:
Huaqing Xie
Huaqing Xie
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Search for other works by this author on:
Yingchun Zhang
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Wei Yu
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
e-mail: yuwei@sspu.edu.cn
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
e-mail: yuwei@sspu.edu.cn
Liye Zhang
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Junshan Yin
Shanghai Yueda New Material Science
and Technology Co. Ltd.,
Shanghai 201209, China
and Technology Co. Ltd.,
Shanghai 201209, China
Jingkang Wang
Shanghai Yueda New Material Science
and Technology Co. Ltd.,
Shanghai 201209, China
and Technology Co. Ltd.,
Shanghai 201209, China
Huaqing Xie
School of Environment and
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
Materials Engineering,
College of Engineering,
Shanghai Polytechnic University,
Shanghai 201209, China
1Corresponding author.
Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF THERMAL SCIENCE AND ENGINEERING APPLICATIONS. Manuscript received January 6, 2017; final manuscript received April 4, 2017; published online August 28, 2017. Assoc. Editor: Jingchao Zhang.
J. Thermal Sci. Eng. Appl. Feb 2018, 10(1): 011014 (5 pages)
Published Online: August 28, 2017
Article history
Received:
January 6, 2017
Revised:
April 4, 2017
Citation
Zhang, Y., Yu, W., Zhang, L., Yin, J., Wang, J., and Xie, H. (August 28, 2017). "Thermal Conductivity and Mechanical Properties of Low-Density Silicone Rubber Filled With Al2O3 and Graphene Nanoplatelets." ASME. J. Thermal Sci. Eng. Appl. February 2018; 10(1): 011014. https://doi.org/10.1115/1.4036797
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