A silicon heat spreader, called hexcell, is presented to develop thin, strong, interconnected, and scalable heat transfer devices for high power electronics cooling. Several key technical aspects, reflected characteristics of fabrication, thermomechanical, hermetic sealing, and heat transfer on wick structures, have been performed to underlie the system integration. The hexcell prototypes are developed through microelectromechanical system photolithography and dry-etch processes, associated with eutectic bonding to form a sealed silicon chamber. Hexcells are structurally optimized to minimize the stress, expanding the maximum operating pressure and temperature ranges. As a result, the developed hexcells can survive 0.32 MPa pressure difference and are able to sustain an operating temperature over . Experimental results of both helium and vapor leakage tests indicate that eutectic bonding with limited bonding surface area may not provide hermetic sealing. Vacuum sealing is achieved by introducing epoxy to fill the leak pine-holes on the bonding interface. The developed hexcell wick exhibits good heat and mass transport performance, reaching a maximum cooling capacity with superheat as demonstrated with a prototype of a heating area.
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e-mail: qcai@teledyne.com
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December 2009
Research Papers
Development of Scalable Silicon Heat Spreader for High Power Electronic Devices
Qingjun Cai,
e-mail: qcai@teledyne.com
Qingjun Cai
Teledyne Scientific & Image Company
, 1049 Camino Dos Rios, Thousand Oaks, CA 91360
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Bing-Chung Chen,
Bing-Chung Chen
Teledyne Scientific & Image Company
, 1049 Camino Dos Rios, Thousand Oaks, CA 91360
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Chailun Tsai,
Chailun Tsai
Teledyne Scientific & Image Company
, 1049 Camino Dos Rios, Thousand Oaks, CA 91360
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Chung-lung Chen
Chung-lung Chen
Teledyne Scientific & Image Company
, 1049 Camino Dos Rios, Thousand Oaks, CA 91360
Search for other works by this author on:
Qingjun Cai
Teledyne Scientific & Image Company
, 1049 Camino Dos Rios, Thousand Oaks, CA 91360e-mail: qcai@teledyne.com
Bing-Chung Chen
Teledyne Scientific & Image Company
, 1049 Camino Dos Rios, Thousand Oaks, CA 91360
Chailun Tsai
Teledyne Scientific & Image Company
, 1049 Camino Dos Rios, Thousand Oaks, CA 91360
Chung-lung Chen
Teledyne Scientific & Image Company
, 1049 Camino Dos Rios, Thousand Oaks, CA 91360J. Thermal Sci. Eng. Appl. Dec 2009, 1(4): 041009 (7 pages)
Published Online: June 24, 2010
Article history
Received:
November 12, 2009
Revised:
April 21, 2010
Online:
June 24, 2010
Published:
June 24, 2010
Citation
Cai, Q., Chen, B., Tsai, C., and Chen, C. (June 24, 2010). "Development of Scalable Silicon Heat Spreader for High Power Electronic Devices." ASME. J. Thermal Sci. Eng. Appl. December 2009; 1(4): 041009. https://doi.org/10.1115/1.4001689
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