Abstract

Stress relaxation data on commercially available copper-beryllium alloy 172 are presented. Test samples were subjected to strains of up to 2% and temperatures from 25 to 181°C. The data show that a high degree of relaxation occurs at higher temperatures and relaxation was found to be independent of the initial stress levels. Time-temperature plots of stress relaxation are presented for designing accelerated relaxation tests on the copper-beryllium alloy tested. The material in the tested condition is generally not used in spring applications and thus results of Austen which compare stress relaxation characteristics of copper-beryllium alloy 172 in the aged and unaged conditions are also presented.

References

1.
Fox
,
A.
, “
Stress Relaxation and Fatigue of Small Diameter Wires Used for Miniature Springs
,” ASME 69-WA/Met-2,
American Society of Mechanical Engineers
,
New York
,
1969
.
2.
Fox
,
A.
, “
Stress Relaxation and Fatigue of Two Electromechanical Spring Materials Strengthened by Thermomechanical Processing
,”
IEEE Transactions on Parts, Materials and Packaging
, Institute of Electrical and Electronics Engineers, Vol.
PMP-7
, No.
1
,
03
1971
, pp.
34
-
47
.
3.
Austen
,
A. S.
and
Taylor
,
W.
, “
Stress Relaxation in Beryllium Copper and Beryllium Nickel Springs
”, in
Proceedings of the 1971 Fourth Annual Connector Symposium
,
Electronic Connector Study Groups, Inc.
,
Cherry Hill, N.J.
,
10
1971
.
4.
Nordstrom
,
T. V.
and
Rohde
,
R. W.
, “
Mechanical Properties and Stress Relaxation of Beryllium Copper Alloy 25
,” Technical Report,
Sandia Laboratories
, Albuquerque, N.M.,
1972
.
5.
Rohde
,
R. W.
and
Nordstrom
,
T. V.
, “
Stress-Relaxation of a Copper 1.87 Wt.% Beryllium Alloy
,”
Materials Science and Engineering
, Vol.
12
,
1973
, pp.
179
-
185
.
6.
Manjoine
,
M. J.
, “
Measuring Stress-Relaxation by a Compliance Method
,”
Journal of Materials
 0022-2453, JMLSA, Vol.
6
, No.
2
,
06
1971
, pp.
253
-
264
.
This content is only available via PDF.
You do not currently have access to this content.