A Dynamic Insulation Technique for Building Envelop by Using Microchannels

Initially designed for electronic system cooling, microchannels represent innovative technologies that can also be harnessed to augment the thermal resistance of building walls. When employed as an additional insulation layer within the building envelope, they have the potential to replace traditional insulating materials like wool, polystyrene, wood fiber, and cotton denim. This article explores modeling and simulation results pertaining to the performance of microchannels integrated into a standard building wall, aiming to provide dynamic thermal resistance for the building envelope. The simulations were conducted using aluminum microchannels featuring a rectangular profile, and various working fluids (air and water) were considered to assess system performance under different fluid conditions. To ensure laminar flow conditions in both working fluids, the Reynolds number was controlled within the range of 100–900 across multiple runs. The simulation and analysis outcomes underscore the viability of fluid flow through microchannels within building walls as a promising insulation technique capable of delivering dynamic thermal resistance and enhancing energy efficiency across diverse building types. Furthermore, the results emphasize that the utilization of water-based fluid within microchannels outperforms air-based fluid flow, particularly in terms of heat transfer and heat dissipation capabilities.