Layer-Wise Modeling of Temperature Distributions and Degree of Cure to Evaluate Process-Induced Deformation and Residual Stress Available to Purchase

In this work, a cure simulation based on a one-dimensional thermochemical model is used to predict the evolution of temperature and degree of cure along the thickness of the composite component during the curing cycle. The one-dimensional heat transfer governing equation through the thickness is coupled with the curing kinetics of the thermoset composite material. Temperatures and degree of cure are then used for a thermo-mechanical analysis using layer-wise 1D elements based on the Carrera Unified Formulation (CUF).

Using 1D models allows for computational costs and enables fast numerical analyses. The impact that thickness has on process-induced stresses and strains is evaluated. In particular, displacements for two flat plates with different layer thicknesses at the end of the process are calculated, and in-plane stress distributions are considered.

The results show the influence of a non-uniform degree of cure along the thickness, resulting in a consequent variation of material properties depending on the layer considered.