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Journal Articles

The Impact of Die Tilt on the Reliability of Packages With Dies Bonded to Substrates Using Silver Sintered Material

Available to Purchase
W. Assaad, J. Ahmed Khan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031006.
Paper No: EP-24-1117
https://doi.org/10.1115/1.4068735
Published Online: June 20, 2025
View Articletitled, The Impact of Die Tilt on the Reliability of Packages With Dies Bonded to Substrates Using Silver Sintered Material
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Topics: Bonding, Copper, Finite element analysis, Reliability, Shear (Mechanics), Silver, Simulation, Sintering, Stress, Warping
Journal Articles

On the Assumption Used for the Time-Dependent Warpage Analysis of Encapsulated Semiconductor Packages

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Sukrut Prashant Phansalkar, Yongrae Jang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031007.
Paper No: EP-25-1056
https://doi.org/10.1115/1.4068884
Published Online: June 20, 2025
View Articletitled, On the Assumption Used for the Time-Dependent Warpage Analysis of Encapsulated Semiconductor Packages
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Topics: Bulk modulus, Poisson ratio, Relaxation (Physics), Temperature, Warping, Shear (Mechanics), Young's modulus, Viscoelasticity
Journal Articles

A Review of the Cu CMP Process in Hybrid Bonding Technology

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Accepted Manuscript
xiaodan Li, Rong Zeng, Xiangyang Shi, Yaning Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag.
Paper No: EP-25-1015
https://doi.org/10.1115/1.4068883
Published Online: June 9, 2025
View Articletitled, A Review of the Cu CMP Process in Hybrid Bonding Technology
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Topics: Bonding, Metals, Density, Packaging, Dielectric materials, Energy consumption, Nanoscale phenomena, Optimization, Reliability, Semiconductor wafers
Journal Articles

Three Decades of Thermal Management Research at DARPA

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Accepted Manuscript
Yogendra Joshi, Aaron Smith, Richard Eden, Sumit De
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag.
Paper No: EP-24-1094
https://doi.org/10.1115/1.4068882
Published Online: June 9, 2025
View Articletitled, Three Decades of Thermal Management Research at DARPA
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Topics: Thermal management, Cooling, Diamonds, Microelectromechanical systems, Casting, Cryogenics, Electronics, Energy dissipation, Gallium nitride, Generative adversarial networks
Journal Articles

Enhancing Early Oral Disease Detection Through Custom Multispectral Light-Emitting Diode Imaging: A Noninvasive Digital Approach for Remote Dental Diagnostics

Open Access
Priyadarshini Natarajan, Rajesh Sirigireddy, Suresh Munuswamy, Samaneh Madanian
Journal: Journal of Engineering and Science in Medical Diagnostics and Therapy
Publisher: ASME
Article Type: Research-Article
ASME J of Medical Diagnostics. February 2026, 9(1): 011105.
Paper No: JESMDT-24-1105
https://doi.org/10.1115/1.4068574
Published Online: May 30, 2025
View Articletitled, Enhancing Early Oral Disease Detection Through Custom Multispectral Light-Emitting Diode Imaging: A Noninvasive Digital Approach for Remote Dental Diagnostics
Open the PDF for Enhancing Early Oral Disease Detection Through Custom Multispectral Light-Emitting Diode Imaging: A Noninvasive Digital Approach for Remote Dental Diagnostics in another window
Topics: Diseases, Imaging, Light-emitting diodes, Matlab, Wavelength, Visualization, Fluorescence
Journal Articles

Manufacturing Challenges of Hybrid Bonding for Chiplets Heterogenerous Integration

Open Access
Accepted Manuscript
Mei-Chien Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag.
Paper No: EP-24-1107
https://doi.org/10.1115/1.4068767
Published Online: May 28, 2025
View Articletitled, Manufacturing Challenges of Hybrid Bonding for Chiplets Heterogenerous Integration
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Topics: Bonding, Manufacturing, Semiconductor wafers, Density, Dielectric materials, Optimization, Overlays (Materials engineering), Reliability, Warping
Journal Articles

Errata: “Immersion Cooling of Suspended and Coated Nano-Phosphor Particles for Extending the Limits of Optical Extraction of Light Emitting Diode” [ASME J. Heat Transfer, 2022, 144(12), p. 122501]

Free
Enes Tamdogan, Mehmet Arik
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Errata
J. Heat Mass Transfer. July 2025, 147(7): 077001.
Paper No: HT-24-1422
https://doi.org/10.1115/1.4068641
Published Online: May 22, 2025
View Articletitled, Errata: “Immersion Cooling of Suspended and Coated Nano-Phosphor Particles for Extending the Limits of Optical Extraction of Light Emitting Diode” [ASME J. Heat Transfer, 2022, 144(12), p. 122501]
Open the PDF for Errata: “Immersion Cooling of Suspended and Coated Nano-Phosphor Particles for Extending the Limits of Optical Extraction of Light Emitting Diode” [ASME J. Heat Transfer, 2022, 144(12), p. 122501] in another window
Topics: Cooling, Heat transfer, Light-emitting diodes, Particulate matter, Phosphors
Journal Articles

Research on Vibration Control of Printed Circuit Boards Based on Piezoelectric Shunting Damping Technology

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Zhen Zhang, Jianxin Zhang, Jun Wu, Tao Wu, Chaoyang Cheng, Jiaqing Shi, Wenjie Wang, Qisong Zhang
Journal: Journal of Vibration and Acoustics
Publisher: ASME
Article Type: Research Papers
J. Vib. Acoust. October 2025, 147(5): 051001.
Paper No: VIB-25-1003
https://doi.org/10.1115/1.4068624
Published Online: May 20, 2025
View Articletitled, Research on Vibration Control of Printed Circuit Boards Based on Piezoelectric Shunting Damping Technology
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Topics: Circuits, Damping, Printed circuit boards, Vibration, Vibration control, Capacitance, Inductors, Resistors
Proceedings Papers

Creation of Lethal Debris from Meteoroid and Orbital Debris Impacts on Leo Solar Array Materials

Free

Hannah Yi, Joel Williamsen, Robert Stellingwerf, Daniel Pechkis
Proc. ASME. HVIS2024, 2024 17th Hypervelocity Impact Symposium, V001T08A011, September 9–13, 2024
Publisher: American Society of Mechanical Engineers
Paper No: HVIS2024-034
https://doi.org/10.1115/HVIS2024-034
View Paper titled, Creation of Lethal Debris from Meteoroid and Orbital Debris Impacts on Leo Solar Array Materials
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Topics: Solar cell arrays
Journal Articles

Optimization of the Reliability of Ball Grid Array Solder Joints Under Random Vibration Conditions Using an Improved Back Propagation Neural Network-Based Particle Swarm Algorithm

Available to Purchase
Miao Zhu, Xuexia Yang, Yanxi Sun, Jinbao Lin, Erqiang Liu, Ze Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031005.
Paper No: EP-24-1084
https://doi.org/10.1115/1.4068450
Published Online: May 16, 2025
View Articletitled, Optimization of the Reliability of Ball Grid Array Solder Joints Under Random Vibration Conditions Using an Improved Back Propagation Neural Network-Based Particle Swarm Algorithm
Open the PDF for Optimization of the Reliability of Ball Grid Array Solder Joints Under Random Vibration Conditions Using an Improved Back Propagation Neural Network-Based Particle Swarm Algorithm in another window
Topics: Algorithms, Artificial neural networks, Ball-Grid-Array packaging, Optimization, Particulate matter, Random vibration, Reliability, Response surface methodology, Simulation, Solder joints
Journal Articles

Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection

Available to Purchase
Ching-Yuan Ho, Haw-Teng Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031004.
Paper No: EP-24-1023
https://doi.org/10.1115/1.4068448
Published Online: May 12, 2025
View Articletitled, Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
Open the PDF for Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection in another window
Topics: Boron, Columns (Structural), Grain size, High temperature, Intermetallic compounds, Solders, Tin, Storage, Packaging, Phase transitions
Journal Articles

A Novel Heatsink for Optimizing Photovoltaic Cell Performance With Passive Cooling Using Perforated Wave-Shaped Fins

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Ahmad Alqatamin, Omar Ali Al-Khashman, Jinzhan Su
Journal: Journal of Solar Energy Engineering
Publisher: ASME
Article Type: Research Papers
J. Sol. Energy Eng. October 2025, 147(5): 051002.
Paper No: SOL-24-1299
https://doi.org/10.1115/1.4068410
Published Online: April 25, 2025
View Articletitled, A Novel Heatsink for Optimizing Photovoltaic Cell Performance With Passive Cooling Using Perforated Wave-Shaped Fins
Open the PDF for A Novel Heatsink for Optimizing Photovoltaic Cell Performance With Passive Cooling Using Perforated Wave-Shaped Fins in another window
Topics: Air flow, Cooling, Fins, Heat sinks, Irradiation (Radiation exposure), Solar cells, Solar energy, Temperature, Photovoltaic cells, Photovoltaic panels
Journal Articles

A Case Study Comparing Both Stochastic and Worst-Case Robust Control Co-Design Under Different Control Structures

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Saeed Azad, Daniel R. Herber
Journal: Journal of Dynamic Systems, Measurement, and Control
Publisher: ASME
Article Type: Technical Briefs
J. Dyn. Sys., Meas., Control. September 2025, 147(5): 054502.
Paper No: DS-24-1122
https://doi.org/10.1115/1.4068144
Published Online: April 11, 2025
View Articletitled, A Case Study Comparing Both Stochastic and Worst-Case Robust Control Co-Design Under Different Control Structures
Open the PDF for A Case Study Comparing Both Stochastic and Worst-Case Robust Control Co-Design Under Different Control Structures in another window
Topics: Design, Uncertainty, Optimal control
Journal Articles

Effect of the Cell Orientation Angle on the Nucleus of a Cultured Vascular Smooth Muscle Cell Subjected to Uniaxial Stretching: A Finite Element Analysis

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Atsutaka Tamura, Shoma Uehara, Yasuhiro Tanabe, Kazuaki Nagayama
Journal: Journal of Engineering and Science in Medical Diagnostics and Therapy
Publisher: ASME
Article Type: Research-Article
ASME J of Medical Diagnostics. August 2025, 8(3): 031020.
Paper No: JESMDT-25-1008
https://doi.org/10.1115/1.4068289
Published Online: April 11, 2025
View Articletitled, Effect of the Cell Orientation Angle on the Nucleus of a Cultured Vascular Smooth Muscle Cell Subjected to Uniaxial Stretching: A Finite Element Analysis
Open the PDF for Effect of the Cell Orientation Angle on the Nucleus of a Cultured Vascular Smooth Muscle Cell Subjected to Uniaxial Stretching: A Finite Element Analysis in another window
Topics: Fibers, Muscle, Rotation, Stress, Surface mount components, Finite element analysis
Journal Articles

Seeking Shapes of Interconnects for Higher Flexibility

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Xiaojie Ma
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. July 2025, 92(7): 071005.
Paper No: JAM-25-1049
https://doi.org/10.1115/1.4068254
Published Online: April 10, 2025
View Articletitled, Seeking Shapes of Interconnects for Higher Flexibility
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Topics: Power semiconductor devices, Shapes, Stress, Fracture (Materials), Thermal loads, Engineering design
Journal Articles

Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems

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Caner Ekin Kiper, Ignacio Gallego-Marcos, Stevin Van Wyk, Yigit Akkus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031003.
Paper No: EP-24-1110
https://doi.org/10.1115/1.4068209
Published Online: April 7, 2025
View Articletitled, Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
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Topics: Flow (Dynamics), Fluids, Relaxation (Physics), Simulation, Temperature, Vapors, Heat, Pressure, Computational fluid dynamics, Turbulence
Includes: Supplementary data
Journal Articles

A Digital Twin Framework Utilizing Machine Learning for Robust Predictive Maintenance: Enhancing Tire Health Monitoring

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Vispi Karkaria, Jie Chen, Christopher Luey, Chase Siuta, Damien Lim, Robert Radulescu, Wei Chen
Journal: Journal of Computing and Information Science in Engineering
Publisher: ASME
Article Type: Research Papers
J. Comput. Inf. Sci. Eng. July 2025, 25(7): 071003.
Paper No: JCISE-24-1419
https://doi.org/10.1115/1.4067270
Published Online: April 3, 2025
View Articletitled, A Digital Twin Framework Utilizing Machine Learning for Robust Predictive Maintenance: Enhancing Tire Health Monitoring
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Topics: Tires, Digital twin, Maintenance
Journal Articles

Submillimeter Reflector for Edge-Emitting Laser Package

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Kuo-Tung Huang, Ying-Che Suang, Hsin-Lin Wu, Cheng-Han Wang, Qi-Hong Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2025, 147(3): 034501.
Paper No: EP-24-1088
https://doi.org/10.1115/1.4068142
Published Online: March 28, 2025
View Articletitled, Submillimeter Reflector for Edge-Emitting Laser Package
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Topics: Lasers
Journal Articles

Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics

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Muhammad Aqil Azman, Mohd Zulkifly Abdullah, Wei Keat Loh, Chun Keang Ooi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031002.
Paper No: EP-24-1099
https://doi.org/10.1115/1.4068143
Published Online: March 28, 2025
View Articletitled, Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
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Topics: Computational fluid dynamics, Flow (Dynamics), Simulation, Viscosity
Journal Articles

An Experimental Study on Material Removal Mechanisms in Quasi-Continuous Wave Fiber Laser Microdrilling of SS 304

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Arvind Kumar Gupta, Ramesh Singh, Deepak Marla
Journal: Journal of Micro and Nano Science and Engineering
Publisher: ASME
Article Type: Technical Briefs
J. Micro Nano Sci. Eng. June 2025, 13(2): 024502.
Paper No: JMNM-25-1001
https://doi.org/10.1115/1.4068127
Published Online: March 28, 2025
View Articletitled, An Experimental Study on Material Removal Mechanisms in Quasi-Continuous Wave Fiber Laser Microdrilling of SS 304
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Topics: Drilling, Fiber lasers, Fluence (Radiation measurement), Lasers, Waves, Imaging