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Journal Articles

Experimental and Numerical Investigation of Flow Boiling in Additive Manufactured Foam Structures With Vapor Pathways

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Justin Broughton, Emanuel Torres, Akshith Narayanan, Yogendra K. Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. February 2024, 146(2): 021002.
Paper No: HT-22-1680
https://doi.org/10.1115/1.4063960
Published Online: November 21, 2023
View Articletitled, Experimental and Numerical Investigation of Flow Boiling in Additive Manufactured Foam Structures With Vapor Pathways
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Topics: Boiling, Flow (Dynamics), Vapors, Additive manufacturing, Fluids, Pressure, Simulation, Computer simulation, Metal foams, Flux (Metallurgy)
Proceedings Papers

Air Cooling of a Vented Enclosure by Combined Conduction, Natural Convection and Radiation

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Enchao Yu, Yogendra K. Joshi
Proc. ASME. IMECE96, Heat Transfer: Volume 2 — Heat Transfer in Turbulent Flows; Fundamentals of Convection Heat Transfer; Fundamentals of Natural Convection in Laminar and Turbulent Flows; Natural Circulation, 323-330, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0083
https://doi.org/10.1115/IMECE1996-0083
View Paper titled, Air Cooling of a Vented Enclosure by Combined Conduction, Natural Convection and Radiation
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Topics: Cooling, Heat conduction, Natural convection, Radiation (Physics), Heat, Heat transfer, Electronic components, Flow (Dynamics), Irradiation (Radiation exposure), Rayleigh number
Proceedings Papers

Application of Block-Implicit Multigrid Approach to Heat Transfer Problems Involving Discrete Heating

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Lan Tang, Yogendra K. Joshi
Proc. ASME. IMECE98, Heat Transfer: Volume 5 — Numerical and Experimental Methods in Heat Transfer, 23-32, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0719
https://doi.org/10.1115/IMECE1998-0719
View Paper titled, Application of Block-Implicit Multigrid Approach to Heat Transfer Problems Involving Discrete Heating
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Topics: Heat transfer, Heating, Heat, Forced convection, Boundary-value problems, Natural convection, Pressure, Rayleigh number, Reynolds number
Proceedings Papers

Effect of Condenser Location and Tubing Length on the Performance of a Compact Two-Phase Thermosyphon

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Lang Yuan, Yogendra K. Joshi, Wataru Nakayama
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 291-299, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24406
https://doi.org/10.1115/IMECE2001/HTD-24406
View Paper titled, Effect of Condenser Location and Tubing Length on the Performance of a Compact Two-Phase Thermosyphon
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Topics: Condensers (steam plant), Tubing, Thermal resistance, Boiling, Coolants, Cooling, Copper, Degrees of freedom, Design, Dimensions
Proceedings Papers

A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling

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S. I. Haider, Yogendra K. Joshi, Wataru Nakayama
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 209-218, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24395
https://doi.org/10.1115/IMECE2001/HTD-24395
View Paper titled, A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling
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Topics: Computer cooling, Two-phase flow, Condensers (steam plant), Temperature, Heat transfer coefficients, Condensation, Heat, Heat pipes, Boiling, Fluids
Journal Articles

Two-Phase Heat Transfer and Flow Regimes in Pin Fin-Enhanced Microgaps—Effect of Pin Spacing

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Pouya Asrar, S. Mostafa Ghiaasiaan, Yogendra K. Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. February 2021, 143(2): 023001.
Paper No: HT-19-1429
https://doi.org/10.1115/1.4048919
Published Online: November 16, 2020
View Articletitled, Two-Phase Heat Transfer and Flow Regimes in Pin Fin-Enhanced Microgaps—Effect of Pin Spacing
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Topics: Boiling, Flow (Dynamics), Heat flux, Fins, Heat transfer coefficients, Vapors, Heat transfer, Two-phase flow
Journal Articles

Comparison of Single-Phase Convection in Additive Manufactured Versus Traditional Metal Foams

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Justin Broughton, Yogendra K. Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2020, 142(8): 082201.
Paper No: HT-19-1558
https://doi.org/10.1115/1.4046972
Published Online: June 8, 2020
View Articletitled, Comparison of Single-Phase Convection in Additive Manufactured Versus Traditional Metal Foams
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Topics: Additive manufacturing, Flow (Dynamics), Fluids, Foams (Chemistry), Heat transfer, Metal foams, Porosity, Thermal conductivity, Pressure drop, Heat transfer coefficients
Journal Articles

Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

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Justin Broughton, Vanessa Smet, Rao R. Tummala, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2018, 140(4): 040801.
Paper No: EP-17-1128
https://doi.org/10.1115/1.4040828
Published Online: August 20, 2018
View Articletitled, Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
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Topics: Cooling, Electronics, Packaging, Temperature, Silicon, High temperature, Heat
Journal Articles

Computational Fluid Dynamics Modeling of Flow Boiling in Microchannels With Nonuniform Heat Flux

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Daniel Lorenzini, Yogendra K. Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2018, 140(1): 011501.
Paper No: HT-16-1351
https://doi.org/10.1115/1.4037343
Published Online: August 23, 2017
View Articletitled, Computational Fluid Dynamics Modeling of Flow Boiling in Microchannels With Nonuniform Heat Flux
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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Heat flux, Microchannels, Pressure drop, Temperature, Two-phase flow, Vapors, Silicon
Journal Articles

Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method

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Banafsheh Barabadi, Satish Kumar, Yogendra K. Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. July 2017, 139(7): 072101.
Paper No: HT-13-1223
https://doi.org/10.1115/1.4035889
Published Online: March 21, 2017
View Articletitled, Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method
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Topics: Heat, Heating, Joules, Principal component analysis, Temperature, Transient heat transfer, Transients (Dynamics), Simulation, Microelectronic devices
Proceedings Papers

Energy Simulations of Data Centers With Hybrid Liquid/Air Cooling and Waste Heat Re-Use

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Seungho Mok, Yogendra K. Joshi, Satish Kumar, Ronald R. Hutchins
Proc. ASME. IMECE2016, Volume 8: Heat Transfer and Thermal Engineering, V008T10A008, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-67625
https://doi.org/10.1115/IMECE2016-67625
View Paper titled, Energy Simulations of Data Centers With Hybrid Liquid/Air Cooling and Waste Heat Re-Use
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Topics: Cooling, Data centers, Engineering simulation, Simulation, Waste heat, Cooling systems, Water, Blades, Energy consumption, Groundwater
Journal Articles

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

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Mohamed H. Nasr, Craig E. Green, Peter A. Kottke, Xuchen Zhang, Thomas E. Sarvey, Yogendra K. Joshi, Muhannad S. Bakir, Andrei G. Fedorov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011006.
Paper No: EP-16-1097
https://doi.org/10.1115/1.4035387
Published Online: January 5, 2017
View Articletitled, Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps
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Topics: Boiling, Flow (Dynamics), Flux (Metallurgy), Heat, Thermal resistance, Heat flux, Wall temperature, Coolants, Pressure drop, Thermal management
Proceedings Papers

Thermal Performance Enhancement of Glass Interposer

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Sangbeom Cho, Yogendra K. Joshi
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A021, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48563
https://doi.org/10.1115/IPACK2015-48563
View Paper titled, Thermal Performance Enhancement of Glass Interposer
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Topics: Glass, Electronics, Packaging, Brittleness, Computer simulation, Cooling, Copper, Design, Electrical resistivity, Modeling
Proceedings Papers

CFD Analysis of Flow Boiling in a Silicon Microchannel With Non-Uniform Heat Flux

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Daniel Lorenzini, Yogendra K. Joshi
Proc. ASME. ICNMM2015, ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, V001T07A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2015-48098
https://doi.org/10.1115/ICNMM2015-48098
View Paper titled, CFD Analysis of Flow Boiling in a Silicon Microchannel With Non-Uniform Heat Flux
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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Heat flux, Microchannels, Silicon, Heat, Flux (Metallurgy), Microelectronic devices, Cooling
Journal Articles

Multiscale Transient Thermal Analysis of Microelectronics

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Banafsheh Barabadi, Satish Kumar, Valeriy Sukharev, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031002.
Paper No: EP-13-1037
https://doi.org/10.1115/1.4029835
Published Online: September 1, 2015
View Articletitled, Multiscale Transient Thermal Analysis of Microelectronics
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Topics: Microelectronic devices, Modeling, Simulation, Temperature, Thermal analysis, Transients (Dynamics), Temperature distribution
Journal Articles

Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors

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Peter A. Kottke, Thomas M. Yun, Craig E. Green, Yogendra K. Joshi, Andrei G. Fedorov
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2016, 138(1): 011501.
Paper No: HT-15-1103
https://doi.org/10.1115/1.4031111
Published Online: August 11, 2015
View Articletitled, Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors
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Topics: Coolants, Cooling, Energy dissipation, Friction, Heat, Heat transfer, Pressure, Pressure drop, Temperature, Vapors
Journal Articles

Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap

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Xuefei Han, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011008.
Paper No: EP-13-1083
https://doi.org/10.1115/1.4028574
Published Online: October 15, 2014
View Articletitled, Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap
Open the PDF for Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap in another window
Topics: Computational fluid dynamics, Control equipment, Flow (Dynamics), Fluids, Heat, Modeling, Temperature, Thermal management, Microfluidics
Journal Articles

Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor

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Vivek Sahu, Andrei G. Fedorov, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031014.
Paper No: EP-13-1105
https://doi.org/10.1115/1.4027901
Published Online: July 15, 2014
View Articletitled, Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor
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Topics: Cooling, Superlattices, Temperature, Transients (Dynamics), Microchannels
Proceedings Papers

Pressure Drop and Heat Transfer Characteristics of Pin Fin Enhanced Microgaps in Single Phase Microfluidic Cooling

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Zhimin Wan, Yogendra K. Joshi
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A086, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-65618
https://doi.org/10.1115/IMECE2013-65618
View Paper titled, Pressure Drop and Heat Transfer Characteristics of Pin Fin Enhanced Microgaps in Single Phase Microfluidic Cooling
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Topics: Cooling, Heat transfer, Microfluidics, Pressure drop, Dimensions, Fins, Computer simulation, Delays, Errors, Friction
Proceedings Papers

Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux

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Zhimin Wan, Yoon Jo Kim, Yogendra K. Joshi
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 911-917, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-88890
https://doi.org/10.1115/IMECE2012-88890
View Paper titled, Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux
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Topics: Cooling, Heat flux, Microfluidics, Modeling, Temperature, Computational fluid dynamics, Heat, Thermal management, Coolants, Errors