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Y. P. Wang
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Proceedings Papers

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 87-96, June 3–5, 2008
Paper No: MicroNano2008-70235
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1063-1068, July 17–22, 2005
Paper No: IPACK2005-73200
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 11-15, July 6–11, 2003
Paper No: IPACK2003-35125
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 839-843, July 6–11, 2003
Paper No: IPACK2003-35153
Proceedings Papers

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 445-450, November 17–22, 2002
Paper No: IMECE2002-39687
Journal Articles
Article Type: Research Papers
J. Vib. Acoust. July 1993, 115(3): 256–263.
Published Online: July 1, 1993
Journal Articles
Article Type: Research Papers
J. Pressure Vessel Technol. February 1989, 111(1): 58–63.
Published Online: February 1, 1989