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Xingjian Yu
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031001.
Paper No: EP-18-1080
Published Online: April 10, 2019
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031005.
Paper No: EP-18-1076
Published Online: April 10, 2019
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 27–30, 2018
Paper No: IPACK2018-8301
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 27–30, 2018
Paper No: IPACK2018-8211
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 27–30, 2018
Paper No: IPACK2018-8210
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A027, August 29–September 1, 2017
Paper No: IPACK2017-74196
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A021, August 29–September 1, 2017
Paper No: IPACK2017-74195
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021003.
Paper No: EP-15-1057
Published Online: April 19, 2016