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Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 26–28, 2021

Paper No: IPACK2021-69882

DOI: https://doi.org/10.1115/IPACK2021-69882

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Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress

Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

J. Electron. Packag. June 2022, 144(2): 021102.

Paper No: EP-21-1053

DOI: https://doi.org/10.1115/1.4052231

Published Online: September 13, 2021

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Topics: Creep, Current density, Electrodiffusion, Solder joints, Temperature, Anodes, Plasticity, Stress

Proceedings Papers

Fatigue Life Law Based on Inelastic Strain Energy Density of Solder Alloys and its Simple Prediction Method

Tomoya Fumikura, Mitsuaki Kato, Takahiro Omori

Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A015, November 16–19, 2020

Paper No: IMECE2020-23675

DOI: https://doi.org/10.1115/IMECE2020-23675

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Topics: Alloys, Density, Fatigue life, Solders

Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 27–29, 2020

Paper No: IPACK2020-2556

DOI: https://doi.org/10.1115/IPACK2020-2556

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Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress

Proceedings Papers

Electromigration Analysis of Power Modules by Electrical-Thermal-Mechanical Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A005, November 11–14, 2019

Paper No: IMECE2019-10558

DOI: https://doi.org/10.1115/IMECE2019-10558

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Topics: Bonding, Electrodiffusion, Wire

Proceedings Papers

Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint

Hiroyuki Kontani, Yoshiharu Kariya, Tomoya Fumikura

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A013, July 16–18, 2013

Paper No: IPACK2013-73192

DOI: https://doi.org/10.1115/IPACK2013-73192

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Topics: Damage, Low cycle fatigue, Solder joints, Tin, Grain boundaries, Fracture (Materials), Stress concentration, Crack propagation, Cycles, Electron backscatter diffraction

Journal citation

NARROW

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Prognostic Health Monitoring Method for Thermal Fatigue Failure of Power Modules Based on Finite Element Method-Based Lagrangian Neural Networks

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

Fatigue Life Law Based on Inelastic Strain Energy Density of Solder Alloys and its Simple Prediction Method

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model

Electromigration Analysis of Power Modules by Electrical-Thermal-Mechanical Coupled Model

Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint

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