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Journal Articles

Solar Irradiance Fluctuation Prediction Methodology Using Artificial Neural Networks

Jane Oktavia Kamadinata, Tan Lit Ken, Tohru Suwa

J. Sol. Energy Eng. June 2020, 142(3): 031003.

Paper No: SOL-19-1206

DOI: https://doi.org/10.1115/1.4045315

Published Online: November 26, 2019

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Topics: Artificial neural networks, Solar radiation, Errors, Solar energy

Journal Articles

Thermal Modeling Technique for Multiple Transistors Within Silicon Chip

Tohru Suwa, Hamid Hadim

J. Electron. Packag. December 2011, 133(4): 041015.

DOI: https://doi.org/10.1115/1.4005291

Published Online: December 23, 2011

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Topics: Finite element analysis, Heat, Modeling, Silicon chips, Temperature, Temperature distribution, Transistors

Proceedings Papers

Multi-Packaging-Level Thermal Modeling Technique for Silicon Chip Transistors

Tohru Suwa, Hamid Hadim

Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1365-1372, November 13–19, 2009

Paper No: IMECE2009-11815

DOI: https://doi.org/10.1115/IMECE2009-11815

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Topics: Integrated circuits, Modeling, Packaging, Silicon chips, Transistors

Proceedings Papers

Optimal Placement of Heat Generating Components at Various Levels of Electronics Packaging

Tohru Suwa, Hamid Hadim

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 185-190, November 13–19, 2009

Paper No: IMECE2009-11795

DOI: https://doi.org/10.1115/IMECE2009-11795

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Topics: Artificial neural networks, Electronic packaging, Heat, Optimization

Proceedings Papers

Multidisciplinary Design and Optimization for Oscillating Flow Polymerase Chain Reaction Microfluidics Device

Tohru Suwa, Hamid Hadim, Yong Shi

Proc. ASME. IMECE2009, Volume 2: Biomedical and Biotechnology Engineering, 187-193, November 13–19, 2009

Paper No: IMECE2009-11820

DOI: https://doi.org/10.1115/IMECE2009-11820

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Topics: Chain, Design, Flow (Dynamics), Microfluidics, Optimization, Transients (Dynamics)

Proceedings Papers

Multidisciplinary Heat Generating Logic Block Placement Optimization Using Genetic Algorithm

Tohru Suwa, Hamid Hadim

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 773-779, July 8–12, 2007

Paper No: IPACK2007-33443

DOI: https://doi.org/10.1115/IPACK2007-33443

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Topics: Electrical wires, Genetic algorithms, Heat, Optimization

Proceedings Papers

Multidisciplinary Placement Optimization of Heat Generating Semiconductor Logic Blocks

Tohru Suwa, Hamid Hadim

Proc. ASME. HT2008, Heat Transfer: Volume 2, 779-787, August 10–14, 2008

Paper No: HT2008-56056

DOI: https://doi.org/10.1115/HT2008-56056

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Topics: Design, Electrical wires, Heat, Optimization, Semiconductors (Materials)

Proceedings Papers

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards Using Artificial Neural Networks

Tohru Suwa, Hamid A. Hadim

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2079-2086, July 17–22, 2005

Paper No: IPACK2005-73178

DOI: https://doi.org/10.1115/IPACK2005-73178

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Topics: Artificial neural networks, Electronic components, Heat, Optimization, Printed circuit boards, Genetic algorithms, Algorithms, Cascades (Fluid dynamics), Density, Electrical wires

Proceedings Papers

Integrated Thermomechanical Design and Optimization of BGA Packages Using Genetic Algorithm

Hamid A. Hadim, Tohru Suwa

Proc. ASME. HT-FED2004, Volume 4, 495-502, July 11–15, 2004

Paper No: HT-FED2004-56512

DOI: https://doi.org/10.1115/HT-FED2004-56512

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Topics: Ball-Grid-Array packages, Design, Genetic algorithms, Optimization, Thermomechanics, Ball-Grid-Array packaging, Electronic packages, Electronic packaging, Electronics, Leakage

Proceedings Papers

A Multidisciplinary Design and Optimization Methodology in Electronics Packaging: Application to BGA Design

Hamid Hadim, Tohru Suwa

Proc. ASME. HT2003, Heat Transfer: Volume 3, 557-564, July 21–23, 2003

Paper No: HT2003-47524

DOI: https://doi.org/10.1115/HT2003-47524

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Topics: Ball-Grid-Array packaging, Design, Electronic packaging, Optimization, Artificial neural networks, Electronic products, Engineering disciplines, Leakage, Packaging, Tradeoffs

Journal Articles

Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review

Hamid Hadim, Tohru Suwa

J. Electron. Packag. September 2008, 130(3): 034001.

DOI: https://doi.org/10.1115/1.2957459

Published Online: July 30, 2008

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Topics: Design, Electronic packaging, Optimization, Optimization algorithms

Proceedings Papers

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Board in Channel Flow Forced Convection Using Artificial Neural Networks

Tohru Suwa, Hamid Hadim

Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 339-347, November 5–11, 2005

Paper No: IMECE2005-81483

DOI: https://doi.org/10.1115/IMECE2005-81483

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Topics: Artificial neural networks, Channel flow, Electronic components, Forced convection, Heat, Optimization, Printed circuit boards, Temperature, Junctions, Heat flux

Proceedings Papers

Integrated Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review

Tohru Suwa, Hamid Hadim

Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 275-286, November 5–10, 2006

Paper No: IMECE2006-15283

DOI: https://doi.org/10.1115/IMECE2006-15283

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Topics: Design, Electronic packaging, Optimization, Artificial neural networks, Experimental design, Modeling, Numerical analysis, Computation, Computer-aided design, Graphical user interfaces

Journal Articles

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards

Tohru Suwa, Hamid Hadim

J. Electron. Packag. March 2007, 129(1): 90–97.

DOI: https://doi.org/10.1115/1.2429715

Published Online: April 19, 2006

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Topics: Genetic algorithms, Heat, Junctions, Optimization, Temperature, Electrical wires, Density, Artificial neural networks, Electronic components

Journal Articles

A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks

Hamid Hadim, Tohru Suwa

J. Electron. Packag. September 2005, 127(3): 306–313.

DOI: https://doi.org/10.1115/1.1997161

Published Online: November 16, 2004

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Topics: Artificial neural networks, Design, Optimization, Ball-Grid-Array packaging, Ball-Grid-Array packages, Solders

Journal citation

NARROW

Solar Irradiance Fluctuation Prediction Methodology Using Artificial Neural Networks

Thermal Modeling Technique for Multiple Transistors Within Silicon Chip

Multi-Packaging-Level Thermal Modeling Technique for Silicon Chip Transistors

Optimal Placement of Heat Generating Components at Various Levels of Electronics Packaging

Multidisciplinary Design and Optimization for Oscillating Flow Polymerase Chain Reaction Microfluidics Device

Multidisciplinary Heat Generating Logic Block Placement Optimization Using Genetic Algorithm

Multidisciplinary Placement Optimization of Heat Generating Semiconductor Logic Blocks

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards Using Artificial Neural Networks

Integrated Thermomechanical Design and Optimization of BGA Packages Using Genetic Algorithm

A Multidisciplinary Design and Optimization Methodology in Electronics Packaging: Application to BGA Design

Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Board in Channel Flow Forced Convection Using Artificial Neural Networks

Integrated Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards

A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks

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