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Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 27–29, 2020
Paper No: IPACK2020-2670
Proceedings Papers

Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A044, November 13–19, 2015
Paper No: IMECE2015-51012
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A011, July 6–9, 2015
Paper No: IPACK2015-48069
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A043, July 6–9, 2015
Paper No: IPACK2015-48377
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A012, July 6–9, 2015
Paper No: IPACK2015-48071
Journal Articles
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. December 2015, 7(4): 041017.
Paper No: TSEA-15-1057
Published Online: September 10, 2015
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021007.
Paper No: EP-14-1041
Published Online: June 1, 2015
Proceedings Papers

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A081, November 14–20, 2014
Paper No: IMECE2014-36022
Proceedings Papers

Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A089, November 15–21, 2013
Paper No: IMECE2013-65958
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A007, July 16–18, 2013
Paper No: IPACK2013-73101
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A015, July 16–18, 2013
Paper No: IPACK2013-73196