1-9 of 9
Takahiro Omori
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 26–28, 2021
Paper No: IPACK2021-69882
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021102.
Paper No: EP-21-1053
Published Online: September 13, 2021
Proceedings Papers

Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A015, November 16–19, 2020
Paper No: IMECE2020-23675
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 27–29, 2020
Paper No: IPACK2020-2556
Proceedings Papers

Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A005, November 11–14, 2019
Paper No: IMECE2019-10558
Journal Articles
Article Type: Research-Article
ASME J Nondestructive Evaluation. August 2018, 1(3): 031004.
Paper No: NDE-17-1105
Published Online: May 3, 2018
Proceedings Papers

Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A082, November 15–21, 2013
Paper No: IMECE2013-65317
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A010, July 16–18, 2013
Paper No: IPACK2013-73161
Proceedings Papers

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 469-478, November 12–18, 2010
Paper No: IMECE2010-37988