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Proceedings Papers

An Effective Method for Modelling Flexible Surfaces of Cloth Objects

Y. F. Zhao, S. T. Tan, T. N. Wong
Proc. ASME. DETC94, 20th Design Automation Conference: Volume 1 — Dynamic Mechanical Systems; Geometric Modeling and Features; Concurrent Engineering, 351-358, September 11–14, 1994
Paper No: DETC1994-0077
DOI: https://doi.org/10.1115/DETC1994-0077
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Topics: Modeling, Textiles, Finite element methods, Deformation, Shapes, Simulation
Proceedings Papers

Computer-Aided Modelling of Cloth Deformation

Y. F. Zhao, S. T. Tan, T. N. Wong, W. J. Chen
Proc. ASME. DETC-CIE96, Volume 3: 22nd Design Automation Conference, V003T03A075, August 18–22, 1996
Paper No: 96-DETC/DAC-1056
DOI: https://doi.org/10.1115/96-DETC/DAC-1056
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Topics: Computer-aided engineering, Deformation, Modeling, Textiles, Finite element methods, Rotation, Thread
Proceedings Papers

Performance Study of Finned Tube Evaporators in a Humid Environment

M. Liu, S. Y. Liang, T. N. Wong, G. K. Nathan
Proc. ASME. TA1997, ASME 1997 Turbo Asia Conference, V001T13A007, September 30–October 2, 1997
Paper No: 97-AA-031
DOI: https://doi.org/10.1115/97-AA-031
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Topics: Air conditioning, Circuits, Cooling, Cross-flow, Dehumidification, Evaporation, Flow (Dynamics), Geometry, Heat, Heat exchangers
Proceedings Papers

Modelling of Transient Slug Flow in Pipeline

T. N. Wong, Y. K. Yau
Proc. ASME. TA1997, ASME 1997 Turbo Asia Conference, V001T13A028, September 30–October 2, 1997
Paper No: 97-AA-052
DOI: https://doi.org/10.1115/97-AA-052
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Topics: Modeling, Pipelines, Slug flows, Transients (Dynamics), Valves, Liquid films, Porosity, Pressure, Shades and shadows, Shock (Mechanics)
Proceedings Papers

A Procedure for Encapsulation in Microchannel

Y. F. Yap, J. C. Chai, N. T. Nguyen, T. N. Wong, L. Yobas
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 417-424, July 8–12, 2007
Paper No: HT2007-32522
DOI: https://doi.org/10.1115/HT2007-32522
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Topics: Microchannels, Drops, Particulate matter, Fluids, Finite volume methods, Flow (Dynamics), Modeling, Pressure, Surface tension, Viscosity
Proceedings Papers

Two-Fluid Electroosmotic Flow in Microchannels

T. N. Wong, Y. Gao, C. Wang, C. Yang, N. T. Nguyen, J. C. Chai, K. T. Ooi
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 97-101, June 6–9, 2008
Paper No: MNHT2008-52054
DOI: https://doi.org/10.1115/MNHT2008-52054
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Topics: Electroosmosis, Flow (Dynamics), Fluids, Microchannels
Proceedings Papers

Assessments of Single-Phase Liquid Cooling Enhancement Techniques for Microelectronic Systems

H. Y. Zhang, D. Pinjala, M. K. Iyer, R. Nagarajan, Y. K. Joshi, T. N. Wong, K. C. Toh
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 43-50, July 17–22, 2005
Paper No: IPACK2005-73040
DOI: https://doi.org/10.1115/IPACK2005-73040
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Topics: Cooling, Metal foams, Microchannels, Pressure drop, Heat sinks, Silicon, Aluminum, Brazing, Copper, Density
Proceedings Papers

Effect of Surface Tension on Stratified Flow in Microchannel

Y. F. Yap, J. C. Chai, K. C. Toh, T. N. Wong
Proc. ASME. ICMM2005, ASME 3rd International Conference on Microchannels and Minichannels, Parts A and B, 679-684, June 13–15, 2005
Paper No: ICMM2005-75190
DOI: https://doi.org/10.1115/ICMM2005-75190
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Topics: Microchannels, Stratified flow, Surface tension, Fluids, Finite volume methods, Flow (Dynamics), Plates (structures)
Proceedings Papers

Numerical Solution of Two-Fluid Electroosmotic Flow

Yandong Gao, Y. F. Yap, T. N. Wong, J. C. Chai, C. Yang, K. T. Ooi
Proc. ASME. ICMM2005, ASME 3rd International Conference on Microchannels and Minichannels, Part B cont’d, 343-348, June 13–15, 2005
Paper No: ICMM2005-75005
DOI: https://doi.org/10.1115/ICMM2005-75005
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Topics: Electroosmosis, Fluids, Flow (Dynamics), Mechanical admittance, Electric potential, Microchannels, Finite volume methods, Ion exchange, Navier-Stokes equations, Preservation
Proceedings Papers

Numerical Modeling of Unidirectional Stratified Flow Between Parallel Plates

Y. F. Yap, J. C. Chai, K. C. Toh, T. N. Wong, Y. C. Lam
Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 707-713, November 13–19, 2004
Paper No: IMECE2004-62209
DOI: https://doi.org/10.1115/IMECE2004-62209
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Topics: Computer simulation, Plates (structures), Stratified flow, Density, Fluids, Viscosity
Proceedings Papers

Particle Transport In Microchannels

Y. F. Yap, J. C. Chai, T. N. Wong, N. T. Nguyen, K. C. Toh, H. Y. Zheng
Proc. ASME. IMECE2006, Heat Transfer, Volume 1, 53-60, November 5–10, 2006
Paper No: IMECE2006-14112
DOI: https://doi.org/10.1115/IMECE2006-14112
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Topics: Microchannels, Particulate matter, Flow (Dynamics), Circular cylinders, Computer simulation, Cylinders, Gravity (Force), Incompressible fluids, Sedimentation
Proceedings Papers

Electrophoretic Motion of Particles in a Microsystem

Y. F. Yap, J. C. Chai, T. N. Wong, N. T. Nguyen, K. C. Toh, H. Y. Zheng
Proc. ASME. IMECE2006, Heat Transfer, Volume 1, 61-62, November 5–10, 2006
Paper No: IMECE2006-14121
DOI: https://doi.org/10.1115/IMECE2006-14121
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Topics: Microelectromechanical systems, Particulate matter, Flow (Dynamics), Electric fields, Electrophoresis, Microchannels, Boundary-value problems, Computer simulation, Drugs, Electroosmosis