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Suresh V. Garimella
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041008.
Paper No: EP-18-1028
Published Online: October 1, 2018
Journal Articles
Article Type: Photo Gallery
J. Heat Transfer. August 2017, 139(8): 080904.
Paper No: HT-17-1162
Published Online: June 5, 2017
Journal Articles
Article Type: Photo Gallery
J. Heat Transfer. February 2017, 139(2): 020901.
Paper No: HT-16-1710
Published Online: January 6, 2017
Proceedings Papers

Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T08A015, July 10–14, 2016
Paper No: HT2016-7243
Journal Articles
Article Type: Research-Article
J. Heat Transfer. February 2017, 139(2): 021502.
Paper No: HT-16-1194
Published Online: November 8, 2016
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010903.
Paper No: EP-15-1083
Published Online: March 10, 2016
Proceedings Papers

Proc. ASME. IMECE2015, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A030, November 13–19, 2015
Paper No: IMECE2015-50238
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A018, July 6–9, 2015
Paper No: IPACK2015-48175
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A023, July 6–9, 2015
Paper No: IPACK2015-48178
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A014, July 6–9, 2015
Paper No: IPACK2015-48177
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A015, July 6–9, 2015
Paper No: IPACK2015-48184
Journal Articles
Article Type: Research-Article
J. Heat Transfer. July 2015, 137(7): 071501.
Paper No: HT-14-1040
Published Online: July 1, 2015
Journal Articles
Article Type: Research-Article
J. Sol. Energy Eng. June 2015, 137(3): 031012.
Paper No: SOL-14-1213
Published Online: June 1, 2015
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041007.
Paper No: EP-13-1115
Published Online: September 19, 2014
Journal Articles
Article Type: Photo Gallery
J. Heat Transfer. August 2014, 136(8): 080917.
Paper No: HT-14-1215
Published Online: August 1, 2014
Journal Articles
Article Type: Research-Article
J. Heat Transfer. October 2014, 136(10): 101503.
Paper No: HT-14-1039
Published Online: July 29, 2014
Includes: Supplementary data
Proceedings Papers

Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A036, November 15–21, 2013
Paper No: IMECE2013-63928
Journal Articles
Article Type: Research-Article
J. Heat Transfer. July 2014, 136(7): 072601.
Paper No: HT-13-1410
Published Online: March 26, 2014
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A051, July 16–18, 2013
Paper No: IPACK2013-73283
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A011, July 16–18, 2013
Paper No: IPACK2013-73057