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Siyi Zhou
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041004.
Paper No: EP-13-1103
Published Online: September 19, 2014
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A003, July 16–18, 2013
Paper No: IPACK2013-73062
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A015, July 16–18, 2013
Paper No: IPACK2013-73225
Proceedings Papers

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 325-333, November 12–18, 2010
Paper No: IMECE2010-37219