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Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 27–30, 2018
Paper No: IPACK2018-8257
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, August 29–September 1, 2017
Paper No: IPACK2017-74017
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A004, July 6–9, 2015
Paper No: IPACK2015-48010
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A005, July 6–9, 2015
Paper No: IPACK2015-48086
Proceedings Papers

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A066, November 14–20, 2014
Paper No: IMECE2014-38594
Proceedings Papers

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A055, November 14–20, 2014
Paper No: IMECE2014-39267
Proceedings Papers

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A071, November 14–20, 2014
Paper No: IMECE2014-38661
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2014, 136(3): 034501.
Paper No: EP-13-1094
Published Online: May 5, 2014
Journal Articles
Article Type: Technology Review
J. Electron. Packag. March 2014, 136(1): 014001.
Paper No: EP-13-1038
Published Online: February 18, 2014
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A002, July 16–18, 2013
Paper No: IPACK2013-73110
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A006, July 16–18, 2013
Paper No: IPACK2013-73291
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A006, July 16–18, 2013
Paper No: IPACK2013-73280
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A007, July 16–18, 2013
Paper No: IPACK2013-73292
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A008, July 16–18, 2013
Paper No: IPACK2013-73293
Topics: Glass
Proceedings Papers

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 485-490, November 9–15, 2012
Paper No: IMECE2012-89799
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041008.
Published Online: November 16, 2012
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031010.
Published Online: July 23, 2012
Proceedings Papers

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 365-373, November 12–18, 2010
Paper No: IMECE2010-39756
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 307-316, July 6–8, 2011
Paper No: IPACK2011-52233
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 655-663, July 19–23, 2009
Paper No: InterPACK2009-89108