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S. Ali Moeini
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Journal Articles

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020903.
Paper No: EP-17-1100
DOI: https://doi.org/10.1115/1.4039265
Published Online: May 9, 2018
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Proceedings Papers

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 29–September 1, 2017
Paper No: IPACK2017-74138
DOI: https://doi.org/10.1115/IPACK2017-74138
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Topics: Cracking (Materials), Fracture (Process), High temperature, Simulation, Thermomechanics, Transients (Dynamics), Tension-leg platforms, Stress, Fracture (Materials), Tin
Proceedings Papers

High Temperature Shear Strength of Cu-Sn Transient Liquid Phase Sintered Interconnects

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A037, July 6–9, 2015
Paper No: IPACK2015-48577
DOI: https://doi.org/10.1115/IPACK2015-48577
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Topics: High temperature, Shear strength, Tin, Transients (Dynamics), Creep, Sinter (Metallurgy), Temperature, Sintering, Tension-leg platforms, Copper