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Roy W. Knight
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010913.
Paper No: EP-15-1108
Published Online: March 10, 2016
Proceedings Papers

Proc. ASME. IMECE2015, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A032, November 13–19, 2015
Paper No: IMECE2015-51999
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A017, July 6–9, 2015
Paper No: IPACK2015-48393
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A071, July 6–9, 2015
Paper No: IPACK2015-48083
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031015.
Paper No: EP-15-1041
Published Online: September 1, 2015
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A045, July 16–18, 2013
Paper No: IPACK2013-73207
Proceedings Papers

Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 759-765, July 8–12, 2012
Paper No: HT2012-58433
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 27-33, July 6–8, 2011
Paper No: IPACK2011-52113
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 327-333, July 19–23, 2009
Paper No: InterPACK2009-89097
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 663-670, July 8–12, 2007
Paper No: IPACK2007-33626