1-2 of 2
Piyas Chowdhury
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
×Close Modal
Sort by
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 27–30, 2018
Paper No: IPACK2018-8337
Journal Articles
Article Type: Research-Article
J. Eng. Mater. Technol. April 2018, 140(2): 020801.
Paper No: MATS-17-1069
Published Online: January 19, 2018