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Piyas Chowdhury
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Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 27–30, 2018
Paper No: IPACK2018-8337
Journal Articles
Article Type: Research-Article
J. Eng. Mater. Technol. April 2018, 140(2): 020801.
Paper No: MATS-17-1069
Published Online: January 19, 2018