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Nobutada Ohno
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Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A022, July 6–9, 2015
Paper No: IPACK2015-48247
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 185-190, July 19–23, 2009
Paper No: InterPACK2009-89384
Journal Articles
Article Type: Review Articles
Appl. Mech. Rev. November 1990, 43(11): 283–295.
Published Online: November 1, 1990