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Michael Osterman
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Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, August 29–September 1, 2017
Paper No: IPACK2017-74249
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A018, July 16–18, 2013
Paper No: IPACK2013-73278
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A009, July 16–18, 2013
Paper No: IPACK2013-73164
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021009.
Published Online: June 11, 2012
Proceedings Papers

Proc. ASME. SMASIS2010, ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 2, 783-792, September 28–October 1, 2010
Paper No: SMASIS2010-3864
Proceedings Papers

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 211-216, November 13–19, 2009
Paper No: IMECE2009-11376
Proceedings Papers

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 191-197, November 13–19, 2009
Paper No: IMECE2009-12181
Proceedings Papers

Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 199-210, November 13–19, 2009
Paper No: IMECE2009-10169
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 405-414, July 8–12, 2007
Paper No: IPACK2007-33554
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 339–345.
Published Online: January 8, 2006