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Michael James Martin
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Journal Articles
Article Type: Technical Briefs
J. Thermal Sci. Eng. Appl. June 2020, 12(3): 034501.
Paper No: TSEA-19-1228
Published Online: October 31, 2019
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011001.
Paper No: EP-13-1066
Published Online: October 6, 2014
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A001, July 16–18, 2013
Paper No: IPACK2013-73053
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A002, July 16–18, 2013
Paper No: IPACK2013-73061
Journal Articles
Article Type: Research-Article
J. Vib. Acoust. April 2014, 136(2): 021003.
Paper No: VIB-12-1098
Published Online: November 26, 2013
Journal Articles
Article Type: Technical Briefs
J. Heat Transfer. September 2013, 135(9): 091601.
Paper No: HT-12-1290
Published Online: July 26, 2013
Proceedings Papers

Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 909-916, March 3–6, 2012
Paper No: MNHMT2012-75312
Proceedings Papers

Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 253-258, March 3–6, 2012
Paper No: MNHMT2012-75317
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021011.
Paper No: EP-12-1075
Published Online: April 12, 2013
Journal Articles
Article Type: Micro/Nanoscale Heat Transfer
J. Heat Transfer. October 2012, 134(10): 102401.
Published Online: August 7, 2012
Proceedings Papers

Proc. ASME. IDETC-CIE2011, Volume 7: 5th International Conference on Micro- and Nanosystems; 8th International Conference on Design and Design Education; 21st Reliability, Stress Analysis, and Failure Prevention Conference, 71-77, August 28–31, 2011
Paper No: DETC2011-47116
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 247-255, July 6–8, 2011
Paper No: IPACK2011-52144
Journal Articles
Article Type: Research Papers
J. Appl. Mech. July 2011, 78(4): 041013.
Published Online: April 13, 2011