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Mehmet Arik
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Journal Articles
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. August 2019, 11(4): 041020.
Paper No: TSEA-18-1686
Published Online: July 31, 2019
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020907.
Paper No: EP-16-1139
Published Online: June 12, 2017
Proceedings Papers

Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A050, November 11–17, 2016
Paper No: IMECE2016-65602
Proceedings Papers

Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T11A003, July 10–14, 2016
Paper No: HT2016-7097
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A016, July 6–9, 2015
Paper No: IPACK2015-48094
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A015, July 6–9, 2015
Paper No: IPACK2015-48326
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A040, July 6–9, 2015
Paper No: IPACK2015-48024
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041006.
Paper No: EP-14-1089
Published Online: October 15, 2015
Journal Articles
Article Type: Research-Article
J. Heat Transfer. February 2016, 138(2): 021702.
Paper No: HT-14-1698
Published Online: October 13, 2015
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021005.
Paper No: EP-14-1018
Published Online: June 1, 2015
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A002, July 16–18, 2013
Paper No: IPACK2013-73031
Proceedings Papers

Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T23A008, July 14–19, 2013
Paper No: HT2013-17833
Journal Articles
Article Type: Research-Article
J. Heat Transfer. November 2013, 135(11): 111009.
Paper No: HT-12-1188
Published Online: September 23, 2013
Journal Articles
Article Type: Heat Transfer Enhancement
J. Heat Transfer. August 2012, 134(8): 081901.
Published Online: May 31, 2012
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 115-122, July 6–8, 2011
Paper No: IPACK2011-52034
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2011, 3(3): 031009.
Published Online: August 12, 2011
Proceedings Papers

Proc. ASME. SMASIS2010, ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 1, 619-626, September 28–October 1, 2010
Paper No: SMASIS2010-3822
Proceedings Papers

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 5, 691-699, August 8–13, 2010
Paper No: IHTC14-23099
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 973-984, July 19–23, 2009
Paper No: InterPACK2009-89322
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 549-556, July 19–23, 2009
Paper No: InterPACK2009-89109