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Journal Articles

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Mahsa Montazeri, Whit M. Vinson, David R. Huitink

J. Electron. Packag. June 2023, 145(2): 021002.

Paper No: EP-22-1037

DOI: https://doi.org/10.1115/1.4055024

Published Online: August 8, 2022

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Topics: Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Current density, Tin

Proceedings Papers

Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects

Mahsa Montazeri, David R. Huitink

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 27–29, 2020

Paper No: IPACK2020-2598

DOI: https://doi.org/10.1115/IPACK2020-2598

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Topics: Electrodiffusion, Solders, Stress, Reliability, Tension, Copper, Current density, Wire, Bonding, Electrical resistance

Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019

Paper No: IPACK2019-6424

DOI: https://doi.org/10.1115/IPACK2019-6424

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Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature

Journal Articles

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

Mahsa Montazeri, Cody J. Marbut, David Huitink

J. Electron. Packag. September 2019, 141(3): 031011.

Paper No: EP-18-1099

DOI: https://doi.org/10.1115/1.4043480

Published Online: May 24, 2019

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Topics: Cycles, Damage, Reliability, Shear (Mechanics), Solders, Stress, Temperature, Fatigue life, Failure, Finite element analysis

Proceedings Papers

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction

Cody J. Marbut, Mahsa Montazeri, David Huitink

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, August 27–30, 2018

Paper No: IPACK2018-8275

DOI: https://doi.org/10.1115/IPACK2018-8275

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Topics: Fatigue failure, Reliability, Stress, Damage, Design, Fatigue, Finite element analysis, Solders, Failure, Flip-chip

Journal citation

NARROW

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction

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Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction

Journals

Conference Proceedings

eBooks

Resources

Opportunities

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