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Madhusudan Iyengar
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021001.
Paper No: EP-17-1126
Published Online: May 9, 2018
Proceedings Papers

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1127-1139, November 9–15, 2012
Paper No: IMECE2012-88957
Proceedings Papers

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 411-420, November 12–18, 2010
Paper No: IMECE2010-40914
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 611-616, July 6–8, 2011
Paper No: IPACK2011-52206
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 617-622, July 6–8, 2011
Paper No: IPACK2011-52207
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 623-627, July 6–8, 2011
Paper No: IPACK2011-52210
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 415-422, July 6–8, 2011
Paper No: IPACK2011-52016
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 577-583, July 6–8, 2011
Paper No: IPACK2011-52165
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 585-593, July 6–8, 2011
Paper No: IPACK2011-52166
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 451-459, July 6–8, 2011
Paper No: IPACK2011-52067
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011007.
Published Online: March 9, 2011
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1063-1075, July 19–23, 2009
Paper No: InterPACK2009-89411
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 953-961, July 19–23, 2009
Paper No: InterPACK2009-89306
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 851-862, July 19–23, 2009
Paper No: InterPACK2009-89212
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 319-326, July 19–23, 2009
Paper No: InterPACK2009-89093
Proceedings Papers

Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1437-1445, November 13–19, 2009
Paper No: IMECE2009-12860
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021009.
Published Online: June 25, 2010
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 871-876, July 8–12, 2007
Paper No: IPACK2007-33899
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 877-886, July 8–12, 2007
Paper No: IPACK2007-33924
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 803-818, July 8–12, 2007
Paper No: IPACK2007-33507