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Leila Choobineh
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021104.
Paper No: EP-20-1142
Published Online: September 24, 2021
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 27–29, 2020
Paper No: IPACK2020-2562
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041109.
Paper No: EP-19-1123
Published Online: June 29, 2020
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031106.
Paper No: EP-19-1098
Published Online: April 24, 2020
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 7–9, 2019
Paper No: IPACK2019-6334
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 7–9, 2019
Paper No: IPACK2019-6514
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, August 29–September 1, 2017
Paper No: IPACK2017-74222
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020908.
Paper No: EP-16-1140
Published Online: June 12, 2017
Proceedings Papers

Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A001, November 11–17, 2016
Paper No: IMECE2016-65543
Proceedings Papers

Proc. ASME. IMECE2013, Volume 7A: Fluids Engineering Systems and Technologies, V07AT08A006, November 15–21, 2013
Paper No: IMECE2013-65865
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A034, July 16–18, 2013
Paper No: IPACK2013-73167
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A004, July 16–18, 2013
Paper No: IPACK2013-73166