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Koichi Sudoh
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Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A006, July 16–18, 2013
Paper No: IPACK2013-73310
Journal Articles
Article Type: Research-Article
J. Eng. Mater. Technol. October 2013, 135(4): 041002.
Paper No: MATS-13-1017
Published Online: June 10, 2013