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Kenji Hirohata
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Journal Articles

Acoustic Emission Measurement and Large-Scale Finite Element Analysis of Stress Concentration in Superconducting Coil During Quench Training

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Junko Hirokawa, Yousuke Hisakuni, Osamu Nishimura, Akira Kano, Hideaki Uehara, Tomoko Monda, Kenji Hirohata, Toshinobu Ito, Shohei Takami, Tomofumi Orikasa, Kiyokazu Sato
Journal: Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems
Publisher: ASME
Article Type: Research Papers
ASME J Nondestructive Evaluation. August 2025, 8(3): 031009.
Paper No: NDE-24-1060
https://doi.org/10.1115/1.4068567
Published Online: June 10, 2025
View Articletitled, Acoustic Emission Measurement and Large-Scale Finite Element Analysis of Stress Concentration in Superconducting Coil During Quench Training
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Topics: Acoustic emissions, Excitation, Finite element methods, Magnetic fields, Resins, Wire, Stress, Electromagnetic force, Acoustic emission testing, Sensors
Journal Articles

Physics-Informed Machine Learning for Surrogate Modeling of Heat Transfer Phenomena

Open Access
Tomoyuki Suzuki, Kenji Hirohata, Yasutaka Ito, Takehiro Hato, Akira Kano
Journal: Journal of Computational and Nonlinear Dynamics
Publisher: ASME
Article Type: Research-Article
J. Comput. Nonlinear Dynam. November 2023, 18(11): 111001.
Paper No: CND-23-1058
https://doi.org/10.1115/1.4063224
Published Online: September 1, 2023
View Articletitled, Physics-Informed Machine Learning for Surrogate Modeling of Heat Transfer Phenomena
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Topics: Errors, Heat sinks, Machine learning, Modeling, Temperature, Thermofluids, Time series, Cooling, Heat transfer
Proceedings Papers

Probabilistic Reliability Analysis Method Based on Surrogate Model for Wind Turbine Drivetrain Structure Subjected to Random Dynamic Load

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Tomohiko Jimbo, Akira Kano, Yousuke Hisakuni, Yasutaka Ito, Kenji Hirohata, Tsuyoshi Ichimura
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T14A011, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94043
https://doi.org/10.1115/IMECE2022-94043
View Paper titled, Probabilistic Reliability Analysis Method Based on Surrogate Model for Wind Turbine Drivetrain Structure Subjected to Random Dynamic Load
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Topics: Event history analysis, Metamodeling, Stress, Wind, Wind turbines
Proceedings Papers

Stress Concentration Mechanism in Superconducting Coil Quench Phenomenon by Large-Scale Finite Element Analysis

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Yousuke Hisakuni, Akira Kano, Hideaki Uehara, Tomoko Monda, Junko Hirokawa, Osamu Nishimura, Kenji Hirohata, Toshinobu Ito, Shohei Takami, Kiyokazu Sato
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T14A029, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94914
https://doi.org/10.1115/IMECE2022-94914
View Paper titled, Stress Concentration Mechanism in Superconducting Coil Quench Phenomenon by Large-Scale Finite Element Analysis
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Topics: Finite element analysis, Stress concentration, Wire, Crack propagation, Deformation, Resins, Acoustic emission testing, Damage, Electromagnetic force, Excitation
Proceedings Papers

Acoustic Emission Measurement and Location Analysis of Acoustic Emission Source for Superconducting Coil Quench During Training

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Junko Hirokawa, Osamu Nishimura, Yousuke Hisakuni, Akira Kano, Hideaki Uehara, Tomoko Monda, Kenji Hirohata, Toshinobu Ito, Shohei Takami, Tomofumi Orikasa, Kiyokazu Sato
Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A006, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-91393
https://doi.org/10.1115/IMECE2022-91393
View Paper titled, Acoustic Emission Measurement and Location Analysis of Acoustic Emission Source for Superconducting Coil Quench During Training
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Topics: Acoustic emission testing, Acoustic emissions
Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

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Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011102.
Paper No: EP-22-1016
https://doi.org/10.1115/1.4055394
Published Online: September 27, 2022
View Articletitled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model
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Topics: Anodes, Creep, Current density, Electrodiffusion, Solder joints, Stress, Temperature
Proceedings Papers

Deriving Thermal Model From Data by Sparse Identification Based on Physical Laws

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Tomoyuki Suzuki, Akira Kano, Kenji Hirohata
Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A003, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-70639
https://doi.org/10.1115/IMECE2021-70639
View Paper titled, Deriving Thermal Model From Data by Sparse Identification Based on Physical Laws
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Topics: Design, Forced convection, Heat capacity, Heat transfer, Machine learning, Maintenance, Natural convection, Network models, Nonlinear dynamical systems, Physical laws
Proceedings Papers

Prognostic Health Monitoring Method for Thermal Fatigue Failure of Power Modules Based on Finite Element Method-Based Lagrangian Neural Networks

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Akira Kano, Tomoko Monda, Tomoyuki Suzuki, Hideaki Uehara, Tomoya Fumikura, Kenji Hirohata
Proc. ASME. IMECE2021, Volume 13: Safety Engineering, Risk, and Reliability Analysis; Research Posters, V013T14A028, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-70783
https://doi.org/10.1115/IMECE2021-70783
View Paper titled, Prognostic Health Monitoring Method for Thermal Fatigue Failure of Power Modules Based on Finite Element Method-Based Lagrangian Neural Networks
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Topics: Artificial neural networks, Fatigue, Fatigue failure, Finite element analysis, Fatigue life, Stress, Reliability, Cycles, Maintenance, Solder joints
Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

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Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69882
https://doi.org/10.1115/IPACK2021-69882
View Paper titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model
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Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress
Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

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Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021102.
Paper No: EP-21-1053
https://doi.org/10.1115/1.4052231
Published Online: September 13, 2021
View Articletitled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model
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Topics: Creep, Current density, Electrodiffusion, Solder joints, Temperature, Anodes, Plasticity, Stress
Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model

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Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2556
https://doi.org/10.1115/IPACK2020-2556
View Paper titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model
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Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress
Proceedings Papers

Electromigration Analysis of Power Modules by Electrical-Thermal-Mechanical Coupled Model

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Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A005, November 11–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2019-10558
https://doi.org/10.1115/IMECE2019-10558
View Paper titled, Electromigration Analysis of Power Modules by Electrical-Thermal-Mechanical Coupled Model
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Topics: Bonding, Electrodiffusion, Wire
Proceedings Papers

Evaluation Method for Performance of SiC Power Module by Electro-Thermal-Anisotropic Stress Coupled Analysis

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Mitsuaki Kato, Akihiro Goryu, Akira Kano, Kazuto Takao, Kenji Hirohata, Satoshi Izumi
Proc. ASME. IMECE2018, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A001, November 9–15, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2018-86626
https://doi.org/10.1115/IMECE2018-86626
View Paper titled, Evaluation Method for Performance of SiC Power Module by Electro-Thermal-Anisotropic Stress Coupled Analysis
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Topics: Anisotropy, Evaluation methods, Stress, Circuits, Temperature, Electrical resistance, MOSFET transistors, Simulation, Electrical properties, Energy conversion
Journal Articles

Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit

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Kenji Hirohata, Yousuke Hisakuni, Takahiro Omori
Journal: Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems
Publisher: ASME
Article Type: Research-Article
ASME J Nondestructive Evaluation. August 2018, 1(3): 031004–031004-12.
Paper No: NDE-17-1105
https://doi.org/10.1115/1.4039938
Published Online: May 3, 2018
View Articletitled, Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit
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Topics: Circuits, Cycles, Failure, Fatigue, Fatigue failure, Solder joints, Stress, Fatigue life
Proceedings Papers

Evaluation Method for Mechanical Stress Dependence of the Electrical Characteristics of SiC MOSFET for Electro-Thermal-Structural Coupled Analysis

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Akihiro Goryu, Mitsuaki Kato, Akira Kano, Satoshi Izumi, Kenji Hirohata
Proc. ASME. IMECE2017, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A019, November 3–9, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2017-72027
https://doi.org/10.1115/IMECE2017-72027
View Paper titled, Evaluation Method for Mechanical Stress Dependence of the Electrical Characteristics of SiC MOSFET for Electro-Thermal-Structural Coupled Analysis
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Topics: Evaluation methods, MOSFET transistors, Stress, Circuits, Tension, Compression, Metals, Simulation, Wire, Aluminum
Proceedings Papers

Fast CT-FFR Analysis Method for the Coronary Artery Based on 4D-CT Image Analysis and Structural and Fluid Analysis

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Mitsuaki Kato, Kenji Hirohata, Akira Kano, Shinya Higashi, Akihiro Goryu, Takuya Hongo, Shigeo Kaminaga, Yasuko Fujisawa
Proc. ASME. IMECE2015, Volume 3: Biomedical and Biotechnology Engineering, V003T03A023, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-51124
https://doi.org/10.1115/IMECE2015-51124
View Paper titled, Fast CT-FFR Analysis Method for the Coronary Artery Based on 4D-CT Image Analysis and Structural and Fluid Analysis
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Topics: Coronary arteries, Fluids, Vessels, Blood flow, Deformation, Flow (Dynamics), Boundary-value problems, Pressure, Stiffness, Aorta
Proceedings Papers

Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole

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Yu Yamayose, Tetsuya Kugimiya, Kenji Hirohata, Akihiko Happoya, Nobutada Ohno, Masao Sakane
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A022, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48247
https://doi.org/10.1115/IPACK2015-48247
View Paper titled, Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole
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Topics: Cycles, Fatigue life, Temperature, Finite element methods, Thin films, Glass, Textiles, Constitutive equations, Creep, Epoxy resins
Proceedings Papers

Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit

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Kenji Hirohata, Yousuke Hisakuni, Takahiro Omori, Tomoko Monda, Minoru Mukai
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A082, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-65317
https://doi.org/10.1115/IMECE2013-65317
View Paper titled, Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit
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Topics: Circuits, Fatigue failure, Printed circuit boards, Solder joints, Ball-Grid-Array packaging, Stress, Density, Failure, Packaging, Probability
Proceedings Papers

Large-Scale Damage Path Simulation for Solder Joints in a BGA Package

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Takahiro Omori, Kenji Hirohata, Tomoko Monda, Minoru Mukai
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A010, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73161
https://doi.org/10.1115/IPACK2013-73161
View Paper titled, Large-Scale Damage Path Simulation for Solder Joints in a BGA Package
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Topics: Ball-Grid-Array packages, Damage, Simulation, Solder joints, Fatigue, Crack propagation, Electronic packages, Fatigue life, Modeling, Printed circuit boards
Proceedings Papers

Health Monitoring Method for Load Assessment and Cooling Performance Degradation of Printed Circuit Boards

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Kenji Hirohata, Katsumi Hisano, Yousuke Hisakuni, Takahiro Omori, Minoru Mukai
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 469-478, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37988
https://doi.org/10.1115/IMECE2010-37988
View Paper titled, Health Monitoring Method for Load Assessment and Cooling Performance Degradation of Printed Circuit Boards
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Topics: Cooling, Printed circuit boards, Stress, Temperature, Computer-aided engineering, Deformation, Electronic equipment, Reliability, Design, Design methodology