Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Publisher
Journal
Article Type
Conference Series
Subject Area
Topics
Date
Availability
1-20 of 25
Kenji Hirohata
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
1
Sort by
Journal Articles
Acoustic Emission Measurement and Large-Scale Finite Element Analysis of Stress Concentration in Superconducting Coil During Quench Training
Available to PurchaseJunko Hirokawa, Yousuke Hisakuni, Osamu Nishimura, Akira Kano, Hideaki Uehara, Tomoko Monda, Kenji Hirohata, Toshinobu Ito, Shohei Takami, Tomofumi Orikasa, Kiyokazu Sato
Publisher: ASME
Article Type: Research Papers
ASME J Nondestructive Evaluation. August 2025, 8(3): 031009.
Paper No: NDE-24-1060
Published Online: June 10, 2025
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Comput. Nonlinear Dynam. November 2023, 18(11): 111001.
Paper No: CND-23-1058
Published Online: September 1, 2023
Proceedings Papers
Probabilistic Reliability Analysis Method Based on Surrogate Model for Wind Turbine Drivetrain Structure Subjected to Random Dynamic Load
Available to Purchase
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T14A011, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94043
Proceedings Papers
Stress Concentration Mechanism in Superconducting Coil Quench Phenomenon by Large-Scale Finite Element Analysis
Available to PurchaseYousuke Hisakuni, Akira Kano, Hideaki Uehara, Tomoko Monda, Junko Hirokawa, Osamu Nishimura, Kenji Hirohata, Toshinobu Ito, Shohei Takami, Kiyokazu Sato
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T14A029, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94914
Proceedings Papers
Acoustic Emission Measurement and Location Analysis of Acoustic Emission Source for Superconducting Coil Quench During Training
Available to PurchaseJunko Hirokawa, Osamu Nishimura, Yousuke Hisakuni, Akira Kano, Hideaki Uehara, Tomoko Monda, Kenji Hirohata, Toshinobu Ito, Shohei Takami, Tomofumi Orikasa, Kiyokazu Sato
Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A006, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-91393
Journal Articles
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011102.
Paper No: EP-22-1016
Published Online: September 27, 2022
Proceedings Papers
Deriving Thermal Model From Data by Sparse Identification Based on Physical Laws
Available to Purchase
Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A003, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-70639
Proceedings Papers
Prognostic Health Monitoring Method for Thermal Fatigue Failure of Power Modules Based on Finite Element Method-Based Lagrangian Neural Networks
Available to Purchase
Proc. ASME. IMECE2021, Volume 13: Safety Engineering, Risk, and Reliability Analysis; Research Posters, V013T14A028, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-70783
Proceedings Papers
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69882
Journal Articles
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021102.
Paper No: EP-21-1053
Published Online: September 13, 2021
Proceedings Papers
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2556
Proceedings Papers
Electromigration Analysis of Power Modules by Electrical-Thermal-Mechanical Coupled Model
Available to Purchase
Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A005, November 11–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2019-10558
Proceedings Papers
Evaluation Method for Performance of SiC Power Module by Electro-Thermal-Anisotropic Stress Coupled Analysis
Available to Purchase
Proc. ASME. IMECE2018, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A001, November 9–15, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2018-86626
Journal Articles
Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit
Available to Purchase
Publisher: ASME
Article Type: Research-Article
ASME J Nondestructive Evaluation. August 2018, 1(3): 031004–031004-12.
Paper No: NDE-17-1105
Published Online: May 3, 2018
Proceedings Papers
Evaluation Method for Mechanical Stress Dependence of the Electrical Characteristics of SiC MOSFET for Electro-Thermal-Structural Coupled Analysis
Available to Purchase
Proc. ASME. IMECE2017, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A019, November 3–9, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2017-72027
Proceedings Papers
Fast CT-FFR Analysis Method for the Coronary Artery Based on 4D-CT Image Analysis and Structural and Fluid Analysis
Available to PurchaseMitsuaki Kato, Kenji Hirohata, Akira Kano, Shinya Higashi, Akihiro Goryu, Takuya Hongo, Shigeo Kaminaga, Yasuko Fujisawa
Proc. ASME. IMECE2015, Volume 3: Biomedical and Biotechnology Engineering, V003T03A023, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-51124
Proceedings Papers
Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole
Available to Purchase
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A022, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48247
Proceedings Papers
Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit
Available to Purchase
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A082, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-65317
Proceedings Papers
Large-Scale Damage Path Simulation for Solder Joints in a BGA Package
Available to Purchase
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A010, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73161
Proceedings Papers
Health Monitoring Method for Load Assessment and Cooling Performance Degradation of Printed Circuit Boards
Available to Purchase
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 469-478, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37988
1