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Kenji Hirohata
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021102.
Paper No: EP-21-1053
Published Online: September 13, 2021
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 27–29, 2020
Paper No: IPACK2020-2556
Proceedings Papers

Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A005, November 11–14, 2019
Paper No: IMECE2019-10558
Proceedings Papers

Proc. ASME. IMECE2018, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A001, November 9–15, 2018
Paper No: IMECE2018-86626
Journal Articles
Article Type: Research-Article
ASME J Nondestructive Evaluation. August 2018, 1(3): 031004.
Paper No: NDE-17-1105
Published Online: May 3, 2018
Proceedings Papers

Proc. ASME. IMECE2017, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A019, November 3–9, 2017
Paper No: IMECE2017-72027
Proceedings Papers

Proc. ASME. IMECE2015, Volume 3: Biomedical and Biotechnology Engineering, V003T03A023, November 13–19, 2015
Paper No: IMECE2015-51124
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A022, July 6–9, 2015
Paper No: IPACK2015-48247
Proceedings Papers

Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A082, November 15–21, 2013
Paper No: IMECE2013-65317
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A010, July 16–18, 2013
Paper No: IPACK2013-73161
Proceedings Papers

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 469-478, November 12–18, 2010
Paper No: IMECE2010-37988
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 247-252, July 19–23, 2009
Paper No: InterPACK2009-89057
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 185-190, July 19–23, 2009
Paper No: InterPACK2009-89384
Proceedings Papers

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 727-732, July 8–12, 2007
Paper No: HT2007-32168
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1215-1221, July 17–22, 2005
Paper No: IPACK2005-73297
Proceedings Papers

Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 289-303, November 5–10, 2006
Paper No: IMECE2006-13800