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Proceedings Papers

Probabilistic Reliability Analysis Method Based on Surrogate Model for Wind Turbine Drivetrain Structure Subjected to Random Dynamic Load

Tomohiko Jimbo, Akira Kano, Yousuke Hisakuni, Yasutaka Ito, Kenji Hirohata, Tsuyoshi Ichimura

Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T14A011, October 30–November 3, 2022

Paper No: IMECE2022-94043

DOI: https://doi.org/10.1115/IMECE2022-94043

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Topics: Event history analysis, Metamodeling, Stress, Wind, Wind turbines

Proceedings Papers

Acoustic Emission Measurement and Location Analysis of Acoustic Emission Source for Superconducting Coil Quench During Training

Junko Hirokawa, Osamu Nishimura, Yousuke Hisakuni, Akira Kano, Hideaki Uehara, Tomoko Monda, Kenji Hirohata, Toshinobu Ito, Shohei Takami, Tomofumi Orikasa, Kiyokazu Sato

Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A006, October 30–November 3, 2022

Paper No: IMECE2022-91393

DOI: https://doi.org/10.1115/IMECE2022-91393

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Topics: Acoustic emission testing, Acoustic emissions

Proceedings Papers

Stress Concentration Mechanism in Superconducting Coil Quench Phenomenon by Large-Scale Finite Element Analysis

Yousuke Hisakuni, Akira Kano, Hideaki Uehara, Tomoko Monda, Junko Hirokawa, Osamu Nishimura, Kenji Hirohata, Toshinobu Ito, Shohei Takami, Kiyokazu Sato

Paper No: IMECE2022-94914

DOI: https://doi.org/10.1115/IMECE2022-94914

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Topics: Finite element analysis, Stress concentration, Wire, Crack propagation, Deformation, Resins, Acoustic emission testing, Damage, Electromagnetic force, Excitation

Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

J. Electron. Packag. March 2023, 145(1): 011102.

Paper No: EP-22-1016

DOI: https://doi.org/10.1115/1.4055394

Published Online: September 27, 2022

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Topics: Anodes, Creep, Current density, Electrodiffusion, Solder joints, Stress, Temperature

Proceedings Papers

Deriving Thermal Model From Data by Sparse Identification Based on Physical Laws

Tomoyuki Suzuki, Akira Kano, Kenji Hirohata

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A003, November 1–5, 2021

Paper No: IMECE2021-70639

DOI: https://doi.org/10.1115/IMECE2021-70639

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Topics: Design, Forced convection, Heat capacity, Heat transfer, Machine learning, Maintenance, Natural convection, Network models, Nonlinear dynamical systems, Physical laws

Proceedings Papers

Prognostic Health Monitoring Method for Thermal Fatigue Failure of Power Modules Based on Finite Element Method-Based Lagrangian Neural Networks

Akira Kano, Tomoko Monda, Tomoyuki Suzuki, Hideaki Uehara, Tomoya Fumikura, Kenji Hirohata

Proc. ASME. IMECE2021, Volume 13: Safety Engineering, Risk, and Reliability Analysis; Research Posters, V013T14A028, November 1–5, 2021

Paper No: IMECE2021-70783

DOI: https://doi.org/10.1115/IMECE2021-70783

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Topics: Artificial neural networks, Fatigue, Fatigue failure, Finite element analysis, Fatigue life, Stress, Reliability, Cycles, Maintenance, Solder joints

Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 26–28, 2021

Paper No: IPACK2021-69882

DOI: https://doi.org/10.1115/IPACK2021-69882

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Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress

Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

J. Electron. Packag. June 2022, 144(2): 021102.

Paper No: EP-21-1053

DOI: https://doi.org/10.1115/1.4052231

Published Online: September 13, 2021

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Topics: Creep, Current density, Electrodiffusion, Solder joints, Temperature, Anodes, Plasticity, Stress

Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 27–29, 2020

Paper No: IPACK2020-2556

DOI: https://doi.org/10.1115/IPACK2020-2556

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Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress

Proceedings Papers

Electromigration Analysis of Power Modules by Electrical-Thermal-Mechanical Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A005, November 11–14, 2019

Paper No: IMECE2019-10558

DOI: https://doi.org/10.1115/IMECE2019-10558

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Topics: Bonding, Electrodiffusion, Wire

Proceedings Papers

Evaluation Method for Performance of SiC Power Module by Electro-Thermal-Anisotropic Stress Coupled Analysis

Mitsuaki Kato, Akihiro Goryu, Akira Kano, Kazuto Takao, Kenji Hirohata, Satoshi Izumi

Proc. ASME. IMECE2018, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A001, November 9–15, 2018

Paper No: IMECE2018-86626

DOI: https://doi.org/10.1115/IMECE2018-86626

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Topics: Anisotropy, Evaluation methods, Stress, Circuits, Temperature, Electrical resistance, MOSFET transistors, Simulation, Electrical properties, Energy conversion

Journal Articles

Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit

Kenji Hirohata, Yousuke Hisakuni, Takahiro Omori

ASME J Nondestructive Evaluation. August 2018, 1(3): 031004–031004-12.

Paper No: NDE-17-1105

DOI: https://doi.org/10.1115/1.4039938

Published Online: May 3, 2018

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Topics: Circuits, Cycles, Failure, Fatigue, Fatigue failure, Solder joints, Stress, Fatigue life

Proceedings Papers

Evaluation Method for Mechanical Stress Dependence of the Electrical Characteristics of SiC MOSFET for Electro-Thermal-Structural Coupled Analysis

Akihiro Goryu, Mitsuaki Kato, Akira Kano, Satoshi Izumi, Kenji Hirohata

Proc. ASME. IMECE2017, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A019, November 3–9, 2017

Paper No: IMECE2017-72027

DOI: https://doi.org/10.1115/IMECE2017-72027

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Topics: Evaluation methods, MOSFET transistors, Stress, Circuits, Tension, Compression, Metals, Simulation, Wire, Aluminum

Proceedings Papers

Fast CT-FFR Analysis Method for the Coronary Artery Based on 4D-CT Image Analysis and Structural and Fluid Analysis

Mitsuaki Kato, Kenji Hirohata, Akira Kano, Shinya Higashi, Akihiro Goryu, Takuya Hongo, Shigeo Kaminaga, Yasuko Fujisawa

Proc. ASME. IMECE2015, Volume 3: Biomedical and Biotechnology Engineering, V003T03A023, November 13–19, 2015

Paper No: IMECE2015-51124

DOI: https://doi.org/10.1115/IMECE2015-51124

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Topics: Coronary arteries, Fluids, Vessels, Blood flow, Deformation, Flow (Dynamics), Boundary-value problems, Pressure, Stiffness, Aorta

Proceedings Papers

Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole

Yu Yamayose, Tetsuya Kugimiya, Kenji Hirohata, Akihiko Happoya, Nobutada Ohno, Masao Sakane

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A022, July 6–9, 2015

Paper No: IPACK2015-48247

DOI: https://doi.org/10.1115/IPACK2015-48247

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Topics: Cycles, Fatigue life, Temperature, Finite element methods, Thin films, Glass, Textiles, Constitutive equations, Creep, Epoxy resins

Proceedings Papers

Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit

Kenji Hirohata, Yousuke Hisakuni, Takahiro Omori, Tomoko Monda, Minoru Mukai

Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A082, November 15–21, 2013

Paper No: IMECE2013-65317

DOI: https://doi.org/10.1115/IMECE2013-65317

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Topics: Circuits, Fatigue failure, Printed circuit boards, Solder joints, Ball-Grid-Array packaging, Stress, Density, Failure, Packaging, Probability

Proceedings Papers

Large-Scale Damage Path Simulation for Solder Joints in a BGA Package

Takahiro Omori, Kenji Hirohata, Tomoko Monda, Minoru Mukai

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A010, July 16–18, 2013

Paper No: IPACK2013-73161

DOI: https://doi.org/10.1115/IPACK2013-73161

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Topics: Ball-Grid-Array packages, Damage, Simulation, Solder joints, Fatigue, Crack propagation, Electronic packages, Fatigue life, Modeling, Printed circuit boards

Proceedings Papers

Health Monitoring Method for Load Assessment and Cooling Performance Degradation of Printed Circuit Boards

Kenji Hirohata, Katsumi Hisano, Yousuke Hisakuni, Takahiro Omori, Minoru Mukai

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 469-478, November 12–18, 2010

Paper No: IMECE2010-37988

DOI: https://doi.org/10.1115/IMECE2010-37988

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Topics: Cooling, Printed circuit boards, Stress, Temperature, Computer-aided engineering, Deformation, Electronic equipment, Reliability, Design, Design methodology

Proceedings Papers

Categorized Application Technology of Numerical Simulation on Electronic Equipment Thermal Design

Yasuyuki Yokono, Katsumi Hisano, Kenji Hirohata

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 247-252, July 19–23, 2009

Paper No: InterPACK2009-89057

DOI: https://doi.org/10.1115/InterPACK2009-89057

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Topics: Computer simulation, Design, Electronic equipment, Simulation, Product development, Physics, Product design

Proceedings Papers

Large-Scale Stress Analyses for Fatigue Reliability at Die-Mount Solder of Plastic IC Packages

Tetsuya Kugimiya, Kenji Hirohata, Minoru Mukai, Eitaro Miyake, Hiroshi Akiba, Nobutada Ohno, Takashi Kawakami

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 185-190, July 19–23, 2009

Paper No: InterPACK2009-89384

DOI: https://doi.org/10.1115/InterPACK2009-89384

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Topics: Fatigue, Reliability, Solders, Stress analysis (Engineering), Finite element analysis, Deformation, Metals, Molding materials, Absorption, Constitutive equations

Journal citation

NARROW

Probabilistic Reliability Analysis Method Based on Surrogate Model for Wind Turbine Drivetrain Structure Subjected to Random Dynamic Load

Acoustic Emission Measurement and Location Analysis of Acoustic Emission Source for Superconducting Coil Quench During Training

Stress Concentration Mechanism in Superconducting Coil Quench Phenomenon by Large-Scale Finite Element Analysis

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Deriving Thermal Model From Data by Sparse Identification Based on Physical Laws

Prognostic Health Monitoring Method for Thermal Fatigue Failure of Power Modules Based on Finite Element Method-Based Lagrangian Neural Networks

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model

Electromigration Analysis of Power Modules by Electrical-Thermal-Mechanical Coupled Model

Evaluation Method for Performance of SiC Power Module by Electro-Thermal-Anisotropic Stress Coupled Analysis

Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit

Evaluation Method for Mechanical Stress Dependence of the Electrical Characteristics of SiC MOSFET for Electro-Thermal-Structural Coupled Analysis

Fast CT-FFR Analysis Method for the Coronary Artery Based on 4D-CT Image Analysis and Structural and Fluid Analysis

Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole

Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit

Large-Scale Damage Path Simulation for Solder Joints in a BGA Package

Health Monitoring Method for Load Assessment and Cooling Performance Degradation of Printed Circuit Boards

Categorized Application Technology of Numerical Simulation on Electronic Equipment Thermal Design

Large-Scale Stress Analyses for Fatigue Reliability at Die-Mount Solder of Plastic IC Packages

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