1-20 of 22
Kazuyoshi Fushinobu
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 26–28, 2021
Paper No: IPACK2021-70410
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 7–9, 2019
Paper No: IPACK2019-6356
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 7–9, 2019
Paper No: IPACK2019-6396
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A001, July 16–18, 2013
Paper No: IPACK2013-73059
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A002, July 16–18, 2013
Paper No: IPACK2013-73060
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 749-755, July 6–8, 2011
Paper No: IPACK2011-52214
Proceedings Papers

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 5, 47-52, August 8–13, 2010
Paper No: IHTC14-22510
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2073-2078, July 17–22, 2005
Paper No: IPACK2005-73151
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 183-188, July 6–11, 2003
Paper No: IPACK2003-35079
Journal Articles