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Kankanhalli N. Seetharamu
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Topics: Heat transfer
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Topics: Heat exchangers
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Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1389-1395, July 17–22, 2005
Paper No: IPACK2005-73053
Journal Articles
Article Type: Technical Papers
J Biomech Eng. August 2007, 129(4): 540–547.
Published Online: December 11, 2006