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Proceedings Papers

Proc. ASME. IMECE2000, Manufacturing Engineering, 157-163, November 5–10, 2000
Paper No: IMECE2000-1803
Proceedings Papers

Proc. ASME. IDETC-CIE2020, Volume 11A: 46th Design Automation Conference (DAC), V11AT11A040, August 17–19, 2020
Paper No: DETC2020-22154
Journal Articles
Article Type: Research Papers
J. Comput. Inf. Sci. Eng. April 2021, 21(2): 021004.
Paper No: JCISE-20-1129
Published Online: October 13, 2020
Journal Articles
Article Type: Research Papers
J. Mech. Des. January 2021, 143(1): 011702.
Paper No: MD-20-1028
Published Online: July 24, 2020
Includes: Supplementary data
Journal Articles
Article Type: Research Papers
ASME J Nondestructive Evaluation. May 2020, 3(2): 021006.
Paper No: NDE-19-1043
Published Online: March 25, 2020
Proceedings Papers

Proc. ASME. IDETC-CIE2019, Volume 2B: 45th Design Automation Conference, V02BT03A015, August 18–21, 2019
Paper No: DETC2019-97466
Journal Articles
Article Type: Research-Article
J. Mech. Des. February 2019, 141(2): 021403.
Paper No: MD-18-1503
Published Online: December 20, 2018
Journal Articles
Article Type: Research-Article
J. Eng. Gas Turbines Power. April 2019, 141(4): 041008.
Paper No: GTP-18-1207
Published Online: November 16, 2018
Proceedings Papers

Proc. ASME. IDETC-CIE2018, Volume 2A: 44th Design Automation Conference, V02AT03A052, August 26–29, 2018
Paper No: DETC2018-85318
Proceedings Papers

Proc. ASME. IDETC-CIE2018, Volume 2A: 44th Design Automation Conference, V02AT03A059, August 26–29, 2018
Paper No: DETC2018-85137
Proceedings Papers

Proc. ASME. IDETC-CIE2017, Volume 2A: 43rd Design Automation Conference, V02AT03A043, August 6–9, 2017
Paper No: DETC2017-67952
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A025, July 16–18, 2013
Paper No: IPACK2013-73309
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A019, July 16–18, 2013
Paper No: IPACK2013-73252
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A014, July 16–18, 2013
Paper No: IPACK2013-73251
Proceedings Papers

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 775-785, November 9–15, 2012
Paper No: IMECE2012-93058
Proceedings Papers

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 911-925, November 11–17, 2011
Paper No: IMECE2011-65833
Proceedings Papers

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 973-986, November 11–17, 2011
Paper No: IMECE2011-65832
Proceedings Papers

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 989-1004, November 11–17, 2011
Paper No: IMECE2011-65834
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021001.
Published Online: June 11, 2012
Proceedings Papers

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 289-302, November 12–18, 2010
Paper No: IMECE2010-40668