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Jungchul Lee
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Journal Articles
Article Type: Research-Article
J. Heat Transfer. July 2020, 142(7): 072101.
Paper No: HT-19-1654
Published Online: May 29, 2020
Journal Articles
Article Type: Research-Article
J. Heat Transfer. May 2016, 138(5): 052401.
Paper No: HT-15-1136
Published Online: February 9, 2016
Includes: Supplementary data
Proceedings Papers

Proc. ASME. IMECE2012, Volume 2: Biomedical and Biotechnology, 29-33, November 9–15, 2012
Paper No: IMECE2012-89642
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 163-169, July 8–12, 2007
Paper No: IPACK2007-33291
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1767-1772, July 17–22, 2005
Paper No: IPACK2005-73456
Proceedings Papers

Proc. ASME. IMECE2005, Microelectromechanical Systems, 731-736, November 5–11, 2005
Paper No: IMECE2005-81698
Proceedings Papers

Proc. ASME. IMECE2005, Microelectromechanical Systems, 95-100, November 5–11, 2005
Paper No: IMECE2005-81732