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Jun-Hyub Park
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Proceedings Papers

Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 1649-1653, January 10–13, 2007
Paper No: MNC2007-21570
Proceedings Papers

Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 495-500, January 10–13, 2007
Paper No: MNC2007-21306
Proceedings Papers

Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 661-665, January 10–13, 2007
Paper No: MNC2007-21280
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1725-1730, July 17–22, 2005
Paper No: IPACK2005-73195
Journal Articles
Journal Articles
Article Type: Technical Papers
J. Eng. Mater. Technol. April 2003, 125(2): 208–214.
Published Online: April 4, 2003