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John H. Lau
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Proceedings Papers

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 79-89, November 5–10, 2000
Paper No: IMECE2000-2249
Proceedings Papers

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 135-144, November 5–10, 2000
Paper No: IMECE2000-2255
Proceedings Papers

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 91-101, November 5–10, 2000
Paper No: IMECE2000-2250
Journal Articles
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020803.
Paper No: EP-20-1059
Published Online: September 3, 2020
Journal Articles
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040801.
Paper No: EP-18-1088
Published Online: May 17, 2019
Journal Articles
Article Type: Review Articles
J. Electron. Packag. September 2016, 138(3): 030802.
Paper No: EP-16-1052
Published Online: July 25, 2016
Journal Articles
Article Type: Review Articles
J. Electron. Packag. December 2014, 136(4): 040801.
Paper No: EP-14-1068
Published Online: October 15, 2014
Proceedings Papers

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 129-136, November 12–18, 2010
Paper No: IMECE2010-40974
Proceedings Papers

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 137-144, November 12–18, 2010
Paper No: IMECE2010-40975
Proceedings Papers

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 69-78, November 12–18, 2010
Paper No: IMECE2010-37783
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 65-73, July 6–8, 2011
Paper No: IPACK2011-52205
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 53-63, July 6–8, 2011
Paper No: IPACK2011-52189
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031010.
Published Online: September 26, 2011
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 67-74, July 19–23, 2009
Paper No: InterPACK2009-89380
Proceedings Papers

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 165-172, November 17–22, 2002
Paper No: IMECE2002-39491
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2006, 128(3): 297–301.
Published Online: July 26, 2006
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 621–624.
Published Online: December 15, 2003
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 602–608.
Published Online: December 15, 2003
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 205–211.
Published Online: July 26, 2002
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 212–220.
Published Online: July 26, 2002