1-11 of 11
Jing He
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
×Close Modal
Sort by
Journal Articles
Article Type: Research-Article
J. Fluids Eng. November 2019, 141(11): 111111.
Paper No: FE-19-1027
Published Online: June 20, 2019
Proceedings Papers

Proc. ASME. POWER2017-ICOPE-17, Volume 2: I&C, Digital Controls, and Influence of Human Factors; Plant Construction Issues and Supply Chain Management; Plant Operations, Maintenance, Aging Management, Reliability and Performance; Renewable Energy Systems: Solar, Wind, Hydro and Geothermal; Risk Management, Safety and Cyber Security; Steam Turbine-Generators, Electric Generators, Transformers, Switchgear, and Electric BOP and Auxiliaries; Student Competition; Thermal Hydraulics and Computational Fluid Dynamics, V002T09A001, June 26–30, 2017
Paper No: POWER-ICOPE2017-3077
Proceedings Papers

Proc. ASME. IMECE2013, Volume 8A: Heat Transfer and Thermal Engineering, V08AT09A020, November 15–21, 2013
Paper No: IMECE2013-63987
Proceedings Papers

Proc. ASME. SBC2012, ASME 2012 Summer Bioengineering Conference, Parts A and B, 913-914, June 20–23, 2012
Paper No: SBC2012-80430
Proceedings Papers

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 23-30, November 12–18, 2010
Paper No: IMECE2010-40471
Proceedings Papers

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 227-234, November 12–18, 2010
Paper No: IMECE2010-39916
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041001.
Published Online: November 17, 2011
Journal Articles
Proceedings Papers

Proc. ASME. ICONE18, 18th International Conference on Nuclear Engineering: Volume 5, 617-624, May 17–21, 2010
Paper No: ICONE18-29930
Topics: Boilers, Design
Journal Articles
Article Type: Research Papers
J. Heat Transfer. June 2011, 133(6): 061701.
Published Online: March 9, 2011
Proceedings Papers

Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 575-582, July 19–23, 2009
Paper No: HT2009-88164