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Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
DOI: https://doi.org/10.1115/1.4056991
Published Online: March 20, 2023
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Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides
Journal Articles

A Hybrid Antenna in Package Solution Using FOWLP Technology

Xuesong Zhang, Qian Wang, Bo Wang, Gang Wang, Xin Gu, Yu Chen, Lin Tan, Shengjuan Zhou, Jian Cai
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031005.
Paper No: EP-21-1024
DOI: https://doi.org/10.1115/1.4051379
Published Online: September 15, 2021
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Topics: Design, Manufacturing, Millimeter waves, Semiconductor wafers, Warping, Waveguides, Solders, Temperature, Molding
Journal Articles

Spectral Photon Monte Carlo With Energy Splitting Across Phases for Gas–Particle Mixtures

Ricardo Marquez, Michael F. Modest, Jian Cai
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. December 2015, 137(12): 121012.
Paper No: HT-14-1368
DOI: https://doi.org/10.1115/1.4030959
Published Online: August 11, 2015
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Topics: Absorption, Emissions, Particulate matter, Photons, Coal
Journal Articles

Comparisons of Radiative Heat Transfer Calculations in a Jet Diffusion Flame Using Spherical Harmonics and k -Distributions

Jian Cai, Ricardo Marquez, Michael F. Modest
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. November 2014, 136(11): 112702.
Paper No: HT-13-1418
DOI: https://doi.org/10.1115/1.4026169
Published Online: September 16, 2014
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Topics: Absorption, Approximation, Carbon dioxide, Combustion, Databases, Flames, Radiation (Physics), Radiative heat transfer, Water, Diffusion flames
Journal Articles

Thermal Resistance Analysis of Sn-Bi Solder Paste Used as Thermal Interface Material for Power Electronics Applications

Rui Zhang, Jian Cai, Qian Wang, Jingwei Li, Yang Hu, Hongda Du, Liangliang Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011012.
Paper No: EP-13-1045
DOI: https://doi.org/10.1115/1.4026616
Published Online: February 18, 2014
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Topics: Electronics, Solders, Thermal resistance, Tin, Plates (structures), Lasers
Proceedings Papers

Comparisons of Radiative Heat Transfer Calculations Using Spherical Harmonics and K -Distributions

Jian Cai, Michael F. Modest
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T01A008, July 14–19, 2013
Paper No: HT2013-17647
DOI: https://doi.org/10.1115/HT2013-17647
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Topics: Radiative heat transfer, Approximation, Combustion gases, Modeling, Radiation (Physics)
Proceedings Papers

Radiative Heat Transfer in High-Pressure Laminar Hydrogen-Air Diffusion Flames Using Spherical Harmonics and K-Distributions

Jian Cai, Shenghui Lei, Adhiraj Dasgupta, Michael F. Modest, Dan C. Haworth
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1771-1777, November 9–15, 2012
Paper No: IMECE2012-88507
DOI: https://doi.org/10.1115/IMECE2012-88507
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Topics: Diffusion flames, High pressure (Physics), Hydrogen, Radiative heat transfer, Flames, Pressure, Radiation (Physics), Water vapor, Cooling, Databases
Proceedings Papers

Photon Monte Carlo Model for High-Pressure Reacting Laminar Flows

Shenghui Lei, Jian Cai, Adhiraj Dasgupta, Michael F. Modest, Daniel Haworth
Proc. ASME. IMECE2012, Volume 6: Energy, Parts A and B, 1265-1271, November 9–15, 2012
Paper No: IMECE2012-88594
DOI: https://doi.org/10.1115/IMECE2012-88594
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Topics: High pressure (Physics), Laminar flow, Photons, Flames, Radiation (Physics), Temperature, Water
Proceedings Papers

The Research of Character of Control Valve on Pipeline

Jing Gong, Jian Cai
Proc. ASME. IPC2008, 2008 7th International Pipeline Conference, Volume 1, 561-567, September 29–October 3, 2008
Paper No: IPC2008-64168
DOI: https://doi.org/10.1115/IPC2008-64168
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Topics: Pipelines, Valves, Flow (Dynamics), Pressure, Control systems, Discharge coefficient, Fluids, Pumps, Simulation, Viscosity