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James E. Simpson
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Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A007, July 16–18, 2013
Paper No: IPACK2013-73314
Proceedings Papers

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 463-468, November 12–18, 2010
Paper No: IMECE2010-37680
Journal Articles
Article Type: Technical Papers
J. Heat Transfer. October 2001, 123(5): 990–998.
Published Online: March 13, 2001