Search Results | ASME Digital Collection

Skip to Main Content

Skip Nav Destination

1-8 of 8

Sort by

Sort Order Select

Proceedings Papers

An Update of the Assessment Methodology for Civil Ageing Management for LTO/CSO Based on International Standards and Engineering Judgement

F. H. E. de Haan - de Wilde, M. J. Janssen

Proc. ASME. PVP2021, Volume 5: Operations, Applications, and Components; Seismic Engineering; Non-Destructive Examination, V005T07A008, July 13–15, 2021

Paper No: PVP2021-61499

DOI: https://doi.org/10.1115/PVP2021-61499

View Paper

Topics: Amperes, Concretes, Containment, Engineering standards, Finite element analysis, Maintenance, Modeling, Nuclear power stations, Nuclear reactors, Performance

Proceedings Papers

Electro-Thermal Simulation of Interconnected Systems at Transient Operating Conditions

Torsten Hauck, Vibhash Jha, J. H. J. Janssen

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A010, August 29–September 1, 2017

Paper No: IPACK2017-74096

DOI: https://doi.org/10.1115/IPACK2017-74096

View Paper

Topics: Simulation, Transients (Dynamics), Finite element model, Boundary-value problems, Computational fluid dynamics, Computational methods, Design, Dynamic systems, Optimization

Proceedings Papers

35-Year Old Splined-Disc Rotor Design for Large Gas Turbines

Manfred J. Janssen, John S. Joyce

Proc. ASME. GT1996, Volume 5: Manufacturing Materials and Metallurgy; Ceramics; Structures and Dynamics; Controls, Diagnostics and Instrumentation; Education; General, V005T14A060, June 10–13, 1996

Paper No: 96-GT-523

DOI: https://doi.org/10.1115/96-GT-523

View Paper

Topics: Design, Disks, Gas turbines, Rotors, Construction, Couplings, Electric power generation, Manufacturing, Stress, Testing

Journal Articles

Response Surface Modeling for Nonlinear Packaging Stresses

W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst

J. Electron. Packag. December 2003, 125(4): 490–497.

DOI: https://doi.org/10.1115/1.1604149

Published Online: December 15, 2003

View Article

Topics: Design, Finite element model, Packaging, Response surface methodology, Stress, Temperature, Optimization, Modeling, Solders, Testing

Journal Articles

Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound

W. D. van Driel, J. H. J. Janssen, G. Q. Zhang, D. G. Yang, L. J. Ernst

J. Electron. Packag. December 2003, 125(4): 520–526.

DOI: https://doi.org/10.1115/1.1604153

Published Online: December 15, 2003

View Article

Topics: Anisotropy, Molding, Packaging, Stress, Temperature, Viscoelasticity, Finite element analysis

Journal Articles

ECN Wind Turbine Test Site at Wieringermeer

L. G. J. Janssen

J. Sol. Energy Eng. November 2003, 125(4): 377.

DOI: https://doi.org/10.1115/1.1629311

Published Online: November 26, 2003

View Article

Topics: Wind turbines, Wakes, Data acquisition, Test facilities

Journal Articles

The Knowledge Center: Wind Turbine Materials and Constructions

L. G. J. Janssen

J. Sol. Energy Eng. November 2003, 125(4): 376.

DOI: https://doi.org/10.1115/1.1629312

Published Online: November 26, 2003

View Article

Topics: Wind turbines

Journal Articles

Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

L. J. Ernst, C. van ’t Hof, D. G. Yang, M. S. Kiasat, G. Q. Zhang, H. J. L. Bressers, J. F. J. Caers, A. W. J. den Boer, J. Janssen

J. Electron. Packag. June 2002, 124(2): 97–105.

DOI: https://doi.org/10.1115/1.1459471

Published Online: May 2, 2002

View Article

Topics: Hardening (Curing), Relaxation (Physics), Shrinkage (Materials), Stress, Modeling, Flip-chip devices, Polymers, Storage, Deformation