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Indira Seshadri
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Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 27–30, 2018
Paper No: IPACK2018-8337
Proceedings Papers

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 411-412, November 11–17, 2011
Paper No: IMECE2011-65638