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Proceedings Papers

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Ji Li, Imin Kao, Vish Prasad

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 439-446, November 16–21, 1997

Paper No: IMECE1997-1121

DOI: https://doi.org/10.1115/IMECE1997-1121

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Topics: Modeling, Semiconductor wafers, Stress, Particulate matter, Wire, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries

Proceedings Papers

Analysis of Stiffness Control and Vibration of Wire in Wiresaw Manufacturing Process

Songbin Wei, Imin Kao

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 813-818, November 15–20, 1998

Paper No: IMECE1998-1096

DOI: https://doi.org/10.1115/IMECE1998-1096

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Topics: Manufacturing, Stiffness, Vibration, Wire, Geometry, Modeling, Excitation, Numerical analysis, Tension, Vibration analysis

Proceedings Papers

Challenges in Slicing Large Diameter Silicon Wafers Using Slurry Wiresaw

Mohan Chandra, Philippe Leyvraz, Jon A. Talbott, Kedar P. Gupta, Imin Kao, Vish Prasad

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 807-811, November 15–20, 1998

Paper No: IMECE1998-1095

DOI: https://doi.org/10.1115/IMECE1998-1095

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Topics: Semiconductor wafers, Slurries, Cutting, Wire, Silicon, Finishes, Particulate matter

Proceedings Papers

Elasto-Plastic Finite Element Analysis of Indentations in Free Abrasive Machining

Milind Bhagavat, Fuqian Yang, Imin Kao

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 819-824, November 15–20, 1998

Paper No: IMECE1998-1097

DOI: https://doi.org/10.1115/IMECE1998-1097

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Topics: Abrasive machining, Finite element analysis, Abrasives, Finite element methods, Fracture (Process), Sawing, Semiconductor wafers, Shapes, Slurries, Stress analysis (Engineering)

Proceedings Papers

High-Resolution Wafer Surface Topology Measurement Using Phase-Shifting Shadow Moiré Technique

Songbin Wei, E. Guan, Imin Kao, Fu-Pen Chiang

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 15-20, November 14–19, 1999

Paper No: IMECE1999-0912

DOI: https://doi.org/10.1115/IMECE1999-0912

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Topics: Resolution (Optics), Semiconductor wafers, Shades and shadows, Topology, Diffraction gratings, Diffraction patterns, Interpolation, Algorithms, Calibration, Diffraction

Proceedings Papers

Computational Model for Free Abrasive Machining of Brittle Silicon Using a Wiresaw

Milind Bhagavat, Imin Kao

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 21-30, November 14–19, 1999

Paper No: IMECE1999-0913

DOI: https://doi.org/10.1115/IMECE1999-0913

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Topics: Abrasive machining, Brittleness, Computer simulation, Silicon, Abrasives, Cutting, Finite element analysis, Fracture (Materials), Abrasion, Machining

Proceedings Papers

Interaction Between Wire and Ingot in Wiresaw Slicing

Fuqian Yang, J. C. M. Li, Imin Kao

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 3-8, November 14–19, 1999

Paper No: IMECE1999-0910

DOI: https://doi.org/10.1115/IMECE1999-0910

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Topics: Wire, Deformation, Stiffness, Friction, Tension, Cutting, Displacement, Finite element analysis, Pressure

Proceedings Papers

Teaching MEMS to Mechanical Engineering Students: A Paradigm Shift From Macro to Micro World

Imin Kao

Proc. ASME. IMECE2001, Mechanical Engineering Design Education: Issues and Case Studies, 61-66, November 11–16, 2001

Paper No: IMECE2001/DE-23289

DOI: https://doi.org/10.1115/IMECE2001/DE-23289

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Topics: Mechanical engineering, Microelectromechanical systems, Students, Teaching, Engineering students, Design, Electrochemistry, Manufacturing, Physics, Scaling laws (Mathematical physics)

Proceedings Papers

Equilibrium Elasto-Hydrodynamic Analysis in Wafer Slicing Process Using Wiresaw

Liqun Zhu, Imin Kao

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 123-128, November 11–16, 2001

Paper No: IMECE2001/EPP-24715

DOI: https://doi.org/10.1115/IMECE2001/EPP-24715

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Topics: Equilibrium (Physics), Semiconductor wafers, Wire, Simulation results

Proceedings Papers

Free Vibration Analysis for Thin Wire of Modern Wiresaw Between Sliced Wafers in Wafer Manufacturing Processes

Songbin Wei, Imin Kao

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 213-219, November 5–10, 2000

Paper No: IMECE2000-2266

DOI: https://doi.org/10.1115/IMECE2000-2266

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Topics: Free vibrations, Manufacturing, Semiconductor wafers, Wire, Vibration, Excitation, Equations of motion, Impulse (Physics), Momentum, Simulation

Proceedings Papers

Analysis of the Interaction Between Thin-Film Fluid Hydrodynamics and Wire Vibration in Wafer Manufacturing Using Wiresaw

Liqun Zhu, Milind Bhagavat, Imin Kao

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 233-241, November 5–10, 2000

Paper No: IMECE2000-2269

DOI: https://doi.org/10.1115/IMECE2000-2269

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Topics: Fluids, Hydrodynamics, Manufacturing, Semiconductor wafers, Thin films, Vibration, Wire, Slurries, Pressure, Computer simulation

Journal Articles

Damped Vibration Response of An Axially Moving Wire Subject to An Oscillating Boundary Condition and the Application to Slurry Wiresaws

Liming Li, Imin Kao

J. Vib. Acoust. October 2021, 143(5): 051002.

Paper No: VIB-20-1302

DOI: https://doi.org/10.1115/1.4049269

Published Online: January 13, 2021

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Topics: Oscillations, Vibration, Wire, Boundary-value problems, Traveling waves, Damping

Journal Articles

Experimental Study of the Impact of a Vibrating Wire on Free Abrasive Machining as Correlated to the Modeling of Vibration Subject to an Oscillating Boundary Condition

Liming Li, Imin Kao

J. Manuf. Sci. Eng. May 2021, 143(5): 051006.

Paper No: MANU-20-1189

DOI: https://doi.org/10.1115/1.4048637

Published Online: November 11, 2020

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Topics: Oscillations, Vibration, Wire, Semiconductor wafers, Slurries, Abrasive machining, Boundary-value problems

Proceedings Papers

Modeling and Experimental Study of the Impact on Free Abrasive Machining (FAM) due to Vibration of a Thin Wire Subject to an Oscillating Boundary Condition

Liming Li, Imin Kao

Proc. ASME. MSEC2019, Volume 2: Processes; Materials, V002T03A026, June 10–14, 2019

Paper No: MSEC2019-2754

DOI: https://doi.org/10.1115/MSEC2019-2754

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Topics: Abrasive machining, Boundary-value problems, Modeling, Vibration, Wire, Silicon, Damping, Slurries, Excitation, Fracture (Materials)

Journal Articles

Assessment of Workspace Attributes Under Simulated Index Finger Proximal Interphalangeal Arthrodesis

Paul G. Arauz, Sue A. Sisto, Imin Kao

J Biomech Eng. May 2016, 138(5): 051005.

Paper No: BIO-15-1506

DOI: https://doi.org/10.1115/1.4032967

Published Online: March 25, 2016

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Topics: Design, Kinematics

Proceedings Papers

Study on the Vibration Response of Axially Moving Continua

Chunhui Chung, Imin Kao

Proc. ASME. DSCC2013, Volume 2: Control, Monitoring, and Energy Harvesting of Vibratory Systems; Cooperative and Networked Control; Delay Systems; Dynamical Modeling and Diagnostics in Biomedical Systems; Estimation and Id of Energy Systems; Fault Detection; Flow and Thermal Systems; Haptics and Hand Motion; Human Assistive Systems and Wearable Robots; Instrumentation and Characterization in Bio-Systems; Intelligent Transportation Systems; Linear Systems and Robust Control; Marine Vehicles; Nonholonomic Systems, V002T18A001, October 21–23, 2013

Paper No: DSCC2013-3811

DOI: https://doi.org/10.1115/DSCC2013-3811

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Topics: Vibration, Belts, Chain, Equations of motion, Laplace transforms, Machinery, Modal analysis, Transfer functions, Transmission parts, Wave propagation

Journal Articles

Experimental Study and Modeling of Lapping Using Abrasive Grits with Mixed Sizes

Chunhui Chung, Chad S. Korach, Imin Kao

J. Manuf. Sci. Eng. June 2011, 133(3): 031006.

DOI: https://doi.org/10.1115/1.4004137

Published Online: June 8, 2011

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Topics: Grinding, Surface roughness, Abrasives, Slurries, Semiconductor wafers, Particulate matter, Modeling

Proceedings Papers

Experimental Study of Lapping Using Mixed Abrasive Grits

Chunhui Chung, Glenn Melendez, Imin Kao

Proc. ASME. MSEC2009, ASME 2009 International Manufacturing Science and Engineering Conference, Volume 1, 729-736, October 4–7, 2009

Paper No: MSEC2009-84210

DOI: https://doi.org/10.1115/MSEC2009-84210

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Topics: Grinding, Semiconductor wafers, Manufacturing, Slurries, Surface roughness, Microelectronic devices, Abrasive machining, Abrasives, Brittleness, Density

Proceedings Papers

Numerical Studies on the Frequency Response of Vibration of Damped Axially Moving Wire

Chunhui Chung, Imin Kao

Proc. ASME. IDETC-CIE2009, Volume 1: 22nd Biennial Conference on Mechanical Vibration and Noise, Parts A and B, 1403-1412, August 30–September 2, 2009

Paper No: DETC2009-86880

DOI: https://doi.org/10.1115/DETC2009-86880

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Topics: Frequency response, Vibration, Wire, Damping, Eigenvalues, Excitation, Slurries, Finishes, Free vibrations, Semiconductor wafers

Proceedings Papers

Damped Vibration Response at Different Speeds of Wire in Slurry Wiresaw Manufacturing Operations

Chunhui Chung, Imin Kao

Proc. ASME. MSEC2008, ASME 2008 International Manufacturing Science and Engineering Conference, Volume 2, 129-138, October 7–10, 2008

Paper No: MSEC_ICM&P2008-72213

DOI: https://doi.org/10.1115/MSEC_ICMP2008-72213

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Topics: Manufacturing, Slurries, Vibration, Wire, Damping, Finishes, Free vibrations, Semiconductor wafers, Fluids, Topology

Journal citation

NARROW

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Analysis of Stiffness Control and Vibration of Wire in Wiresaw Manufacturing Process

Challenges in Slicing Large Diameter Silicon Wafers Using Slurry Wiresaw

Elasto-Plastic Finite Element Analysis of Indentations in Free Abrasive Machining

High-Resolution Wafer Surface Topology Measurement Using Phase-Shifting Shadow Moiré Technique

Computational Model for Free Abrasive Machining of Brittle Silicon Using a Wiresaw

Interaction Between Wire and Ingot in Wiresaw Slicing

Teaching MEMS to Mechanical Engineering Students: A Paradigm Shift From Macro to Micro World

Equilibrium Elasto-Hydrodynamic Analysis in Wafer Slicing Process Using Wiresaw

Free Vibration Analysis for Thin Wire of Modern Wiresaw Between Sliced Wafers in Wafer Manufacturing Processes

Analysis of the Interaction Between Thin-Film Fluid Hydrodynamics and Wire Vibration in Wafer Manufacturing Using Wiresaw

Damped Vibration Response of An Axially Moving Wire Subject to An Oscillating Boundary Condition and the Application to Slurry Wiresaws

Experimental Study of the Impact of a Vibrating Wire on Free Abrasive Machining as Correlated to the Modeling of Vibration Subject to an Oscillating Boundary Condition

Modeling and Experimental Study of the Impact on Free Abrasive Machining (FAM) due to Vibration of a Thin Wire Subject to an Oscillating Boundary Condition

Assessment of Workspace Attributes Under Simulated Index Finger Proximal Interphalangeal Arthrodesis

Study on the Vibration Response of Axially Moving Continua

Experimental Study and Modeling of Lapping Using Abrasive Grits with Mixed Sizes

Experimental Study of Lapping Using Mixed Abrasive Grits

Numerical Studies on the Frequency Response of Vibration of Damped Axially Moving Wire

Damped Vibration Response at Different Speeds of Wire in Slurry Wiresaw Manufacturing Operations

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